NL17SZ125
http://onsemi.com
9
PACKAGE DIMENSIONS
SOT553, 5 LEAD
CASE 463B
ISSUE B
e
M
0.08 (0.003)
X
b 5 PL
A
c
X
Y
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
D
E
Y
12
3
4
5
L
1.35
0.0531
0.5
0.0197
mm
inches
SCALE 20:1
0.5
0.0197
1.0
0.0394
0.45
0.0177
0.3
0.0118
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
HE
DIM
A
MIN
NOM
MAX
MIN
MILLIMETERS
0.50
0.55
0.60
0.020
INCHES
b
0.17
0.22
0.27
0.007
c
D
1.50
1.60
1.70
0.059
E
1.10
1.20
1.30
0.043
e
0.50 BSC
L
0.10
0.20
0.30
0.004
0.022
0.024
0.009
0.011
0.063
0.067
0.047
0.051
0.008
0.012
NOM
MAX
1.50
1.60
1.70
0.059
0.063
0.067
HE
0.08
0.13
0.18
0.003
0.005
0.007
0.020 BSC