參數(shù)資料
型號(hào): NIS3001QPT1
廠商: ON SEMICONDUCTOR
元件分類: 穩(wěn)壓器
英文描述: Integrated Driver and MOSFET Power Chip for Synchronous Buck Controllers
中文描述: 4 A SWITCHING REGULATOR, 1000 kHz SWITCHING FREQ-MAX, BCC21
封裝: QFN-21
文件頁(yè)數(shù): 1/18頁(yè)
文件大?。?/td> 208K
代理商: NIS3001QPT1
Semiconductor Components Industries, LLC, 2003
October, 2003 Rev. 5
1
Publication Order Number:
NIS3001/D
NIS3001
Integrated Driver and
MOSFET Power Chip for
Synchronous Buck
Controllers
The NIS3001 is an integrated multichip solution for high power
DC to DC synchronous buck converters. It contains two power
MOSFETs that are controlled by an internal Driver. All three die are
packaged in a power QFN package called PInPAK
. The 10.5 by
10.5 mm PInPAK
package increases power density and simplifies
PCB layout. The device can be used in single or multiphase
applications.
The NIS3001 implements the newest MOSFET technology. The
control MOSFET is designed to provide improved switching
performance and operates at a much lower temperature compared to
discrete solutions. The synchronous MOSFET is designed to reduce
conduction and switching losses at high frequencies. The integrated
solution greatly reduces the parasitic inductance associated with
conventional discrete buck converters and results in the highest
power conversion efficiency.
The power density of the NIS3001 is optimized based on MOSFET
die size and PInPAK design. The PInPAK layout allows for direct
routing into each power terminal. This results in a better thermal
solution for the system. In addition its thermal resistance is 50%
lower than BGAs. In summary, the NIS3001 has an improved
efficiency, reliability and scalability for multiphase synchronous
buck converters.
Features
Matched MOSFETs for Optimal Efficiency
10.5 mm x 10.5 mm Power QFN Package, PInPAK
25 A DC Output Current
7.0 to 14 V Input Voltage Range
Internal Thermal Shutdown
Operating Frequency Range up to 1,000 kHz
0.7 V to 5.1 V Output Voltage Range
Nominal DutyCycle 5% to 50%
Hi Side
Discrete
FETs
Lo Side
Discrete
FETs
Figure 1.
VS
VIN
DRN
PGND
Analog
Driver
IC
CASE 500
PInPAK
10.5x10.5 PLLP
http://onsemi.com
Device
Package
Shipping
ORDERING INFORMATION
NIS3001QPT1
PInPAK
1500/Tape & Reel
NIS3001 = Specific Device Code
A
= Assembly Site
WL = Wafer Lot
YY
= Year
WW = Work Week
MARKING
DIAGRAM
NIS3001QP
AWLYYWW
(Bottom View)
11
12
13
10
7
9
8
5
6
1
2
3
4
14
16
18
19
15
17
20
21
PINOUT DIAGRAM
For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
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