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參數(shù)資料
| 型號： | NIS1050MNTBG |
| 廠商： | ON Semiconductor |
| 文件頁數(shù)： | 2/5頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC PWR INTERFACE PROTECT 6-WDFN |
| 標準包裝： | 1 |
| 應用： | 移動通信 |
| 電源電壓： | 3 V ~ 30 V |
| 封裝/外殼： | 6-WDFN 裸露焊盤 |
| 供應商設備封裝： | 6-WDFN（2x2） |
| 包裝： | 標準包裝 |
| 安裝類型： | 表面貼裝 |
| 其它名稱： | NIS1050MNTBGOSDKR |
NIS1050
http://onsemi.com
2
Figure 3. Pin Assignment
1
2
3
6
5
4
8
7
Table 1. FUNCTIONAL PIN DESCRIPTION
Pin
Function
Description
1
Source
This is the source of the power FET and connects to the PMIC pin of the same name.
2
Gate
This pin is the gate of the FET switch.
3, 7
Vin
Positive input voltage to the device.
4
Ground
Negative input voltage to the device. This is used as the internal reference for the IC.
5
Vout
This is the output of the internal LDO. It passes the input voltage through to the output and clamps
that voltage if it exceeds the regulation limit.
6, 8
Drain
Positive input voltage to the device.
Table 2. MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Input Voltage, Operating, Steady-State (OVP_sense to Gnd)
Vin
-0.3 to 30
V
Gate-to-Source Voltage
VGS
±8
V
Drain Current, Peak (10 ms pulse)
IDpk
20
A
Drain Current, Continuous (Note 1, Steady-State)
TA = 25°C
TA = 85°C
ID
3.7
2.7
A
Pmax
750
mW
Operating Temperature Range
TJ
-40 to 125
°C
Non-operating Temperature Range
TJ
-55 to 150
°C
Maximum Lead Temperature for Soldering Purposes
TL
260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Surface Mounted on FR4 Board using the minimum recommended pad size of 30 mm2, 2 oz Cu.
2. Dual die operation (equallyheated).
Table 3. THERMAL RESISTANCE RATINGS
Parameter
Symbol
Max
Unit
SINGLE DIE OPERATION (SELF-HEATED)
Junction-to-Ambient – Steady State (Note 3)
RqJA
83
°C/W
Junction-to-Ambient – Steady State Min Pad (Note 4)
RqJA
177
Junction-to-Ambient – t ≤ 5 s (Note 3)
RqJA
54
DUAL DIE OPERATION (EQUALLY-HEATED)
Junction-to-Ambient – Steady State (Note 3)
RqJA
58
°C/W
Junction-to-Ambient – Steady State Min Pad (Note 4)
RqJA
133
Junction-to-Ambient – t ≤ 5 s (Note 3)
RqJA
40
3. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.127 in sq [2 oz] including traces).
4. Surface Mounted on FR4 Board using the minimum recommended pad size (30 mm2, 2 oz Cu).
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