參數(shù)資料
型號: NFR25H
廠商: Vishay Intertechnology,Inc.
英文描述: Fusible, Non-Flammable Resistors
中文描述: 易熔,不易燃電阻
文件頁數(shù): 7/8頁
文件大?。?/td> 96K
代理商: NFR25H
Document Number: 28737
Revision: 24-Feb-04
For technical questions contact: ff3dresistors@vishay.com
www.vishay.com
7
NFR25/25H
Fusible, Non-Flammable Resistors
Vishay BCcomponents
TESTS AND REQUIREMENTS
Essentially all tests are carried out in accordance with the
schedule of “IEC publication 60115-1”, category LCT/UCT/56
(rated temperature range: Lower Category Temperature,
Upper Category Temperature; damp heat, long term, 56 days).
The testing also covers the requirements specified by EIA and
EIAJ.
The tests are carried out in accordance with IEC publication
60068-2, “Recommended basic climatic and mechanical
robustness testing procedure for electronic components” and
under standard atmospheric conditions according to
“IEC 60068-1”, subclause 5.3.
In the Test Procedures and Requirements table the tests and
requirements are listed with reference to the relevant clauses
of
“IEC publications
60115-1 and 60068-2”;
description of the test procedure is also given. In some
instances deviations from the IEC recommendations were
necessary for our method of specifying. For inflammability
requirements reference is made to “IEC 60115-1” and to
“EN 140000, appendix D”.
a
short
All soldering tests are performed with mildly activated flux.
TEST PROCEDURES AND REQUIREMENTS
IEC
60068-2
TEST
METHOD
IEC 60115-1
CLAUSE
TEST
PROCEDURE
REQUIREMENTS
NFR25
NFR25H
TESTS IN ACCORDANCE WITH THE SCHEDULE OF IEC PUBLICATION 60115-8
4.4.1
visual examination
no holes; clean surface; no damage
4.4.2
dimensions (outline)
gauge (mm)
see Dimensions Table
4.5
resistance
applied voltage (+ 0/
10 %):
R
R
nom
: max.
±
5 %
R < 10
: 0.1 V
10
R
<
100
: 0.3 V
100
R
<
1 k
: 1 V
1 k
R
<
10 k
: 3 V
10 k
R
15 k
: 10 V
thermal shock: 3 s; 350
°
C;
3 mm from body
isopropyl alcohol or H
O followed by
brushing in accordance with
“MIL 202 F
2 s; 235
°
C
500 V (RMS) during
1 minute; metal block method
4.18
20 (Tb)
resistance to soldering
heat
component solvent
resistance
solderability
voltage proof on
insulation
robustness of
terminations:
tensile all samples
bending half number of samples
torsion other half of samples
R/R max.:
±
0.25 % + 0.05
4.29
45 (Xa)
no visual damage
4.17
4.7
20 (Ta)
good tinning; no damage
no breakdown or flashover
4.16
21 (U)
4.16.2
4.16.3
4.16.4
21 (Ua1)
21 (Ub)
21 (Uc)
load 10 N; 10 s
load 5 N; 4
×
90
°
3
×
360
°
in opposite directions
number of failures
<
10
×
10
6
number of failures
<
10
×
10
6
no damage
R/R max.:
±
0.25 % + 0.05
no damage
R/R max.:
±
0.25 % + 0.05
no damage
R/R max.:
±
0.25 % + 0.05
4.20
29 (Eb)
bump
3
×
1500 bumps in 3 directions; 40 g
4.22
6 (Fc)
vibration
frequency 10 to 500 Hz; displacement
1.5 mm or acceleration 10 g;
3 directions; total 6 hours (3
×
2 hours)
4.19
14 (Na)
rapid change of
temperature
30 minutes at LCT and
30 minutes at UCT; 5 cycles
no visual damage
R/R max.:
±
0.25 % + 0.05
4.23
4.23.3
climatic sequence:
damp heat (accelerated)
1
st
cycle
damp heat (accelerated)
remaining cycles
30 (Db)
4.23.6
30 (Db)
6 days; 55
°
C; 95 to 98 % RH
R
ins
min.: 10
3
M
R/R max.:
±
1 % + 0.05
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