
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
SOIC
Package
Drawing
D
Pins Package
Qty
75
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
NE5532AD
ACTIVE
8
Pb-Free
(RoHS)
Pb-Free
(RoHS)
None
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
None
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
CU NIPDAU
Level-2-250C-1 YEAR
NE5532ADR
ACTIVE
SOIC
D
8
2500
CU NIPDAU
Level-2-250C-1 YEAR
NE5532AIP
NE5532AP
OBSOLETE
ACTIVE
PDIP
PDIP
P
P
8
8
Call TI
CU NIPDAU
Call TI
Level-NC-NC-NC
50
NE5532APSR
ACTIVE
SO
PS
8
2000
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Level-2-250C-1 YEAR
NE5532D
ACTIVE
SOIC
D
8
75
CU NIPDAU
NE5532DR
ACTIVE
SOIC
D
8
2500
CU NIPDAU
Level-2-250C-1 YEAR
NE5532IP
NE5532P
OBSOLETE
ACTIVE
PDIP
PDIP
P
P
8
8
Call TI
CU NIPDAU
Call TI
Level-NC-NC-NC
50
NE5532PSR
ACTIVE
SO
PS
8
2000
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Level-NC-NC-NC
SA5532AD
ACTIVE
SOIC
D
8
75
CU NIPDAU
SA5532ADR
ACTIVE
SOIC
D
8
2500
CU NIPDAU
SA5532AP
ACTIVE
PDIP
P
8
50
CU NIPDAU
SA5532D
ACTIVE
SOIC
D
8
75
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Level-NC-NC-NC
SA5532DR
ACTIVE
SOIC
D
8
2500
CU NIPDAU
SA5532P
ACTIVE
PDIP
P
8
50
CU NIPDAU
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check
for the latest availability information and additionalproduct content details.
Not yet available Lead (Pb-Free).
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
The information provided on this page represents TI's knowledge and belief as of the date that it is