參數(shù)資料
型號: NE5532AD8R2G
廠商: ON Semiconductor
文件頁數(shù): 2/10頁
文件大小: 0K
描述: IC OPAMP DUAL LOW NOISE 8-SOIC
標準包裝: 1
放大器類型: 通用
電路數(shù): 2
轉換速率: 9 V/µs
增益帶寬積: 10MHz
電流 - 輸入偏壓: 200nA
電壓 - 輸入偏移: 500µV
電流 - 電源: 8mA
電流 - 輸出 / 通道: 38mA
電壓 - 電源,單路/雙路(±): ±3 V ~ 20 V
工作溫度: 0°C ~ 70°C
安裝類型: 表面貼裝
封裝/外殼: 8-SOIC(0.154",3.90mm 寬)
供應商設備封裝: 8-SOICN
包裝: 剪切帶 (CT)
其它名稱: NE5532AD8R2GOSCT
NE5532, SA5532, SE5532, NE5532A, SE5532A
http://onsemi.com
10
PACKAGE DIMENSIONS
SOIC16 WB
D SUFFIX
CASE 751G03
ISSUE D
D
14X
B
16X
SEATING
PLANE
S
A
M
0.25
B S
T
16
9
8
1
h
X
45
_
M
B
M
0.25
H
8X
E
B
A
e
T
A1
A
L
C
q
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INLCUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 TOTAL IN
EXCESS OF THE B DIMENSION AT MAXIMUM
MATERIAL CONDITION.
DIM MIN
MAX
MILLIMETERS
A
2.35
2.65
A1
0.10
0.25
B
0.35
0.49
C
0.23
0.32
D 10.15 10.45
E
7.40
7.60
e
1.27 BSC
H 10.05 10.55
h
0.25
0.75
L
0.50
0.90
q
0
7
_
11.00
16X
0.58
16X
1.62
1.27
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT
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NE5532/D
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