參數(shù)資料
型號: NCV8509PDW25R2
廠商: ON SEMICONDUCTOR
元件分類: 基準電壓源/電流源
英文描述: Sequenced Linear Dual-Voltage Regulator
中文描述: DUAL OUTPUT, FIXED POSITIVE REGULATOR, PDSO16
封裝: SOIC-16
文件頁數(shù): 13/16頁
文件大?。?/td> 123K
代理商: NCV8509PDW25R2
NCV8509 Series
http://onsemi.com
13
Figure 38. V
IN
Shunt
Max V
IN
Delta
I(V
IN2
)
×
R
EX
Shunt Off
Shunt On
V
IN2
V
IN1
4.5 V
Mode 1
VREF
Mode 2
VSAT
Mode 3
VREF
VIN1
VSAT
VIN2
VIN1
VSAT
VREF
VIN1
VREF
(IOUT2
REX)
VIN2
VREF
VIN1
(IOUT2
REX)
VIN2
VIN1
(IOUT2
REX)
Figure 39. 16 Lead SOW (Exposed Pad), JA as a
Function of the Pad Copper Area (2 oz. Cu
Thickness), Board Material = 0.0625 G10/R4
40
70
90
100
T
J
J
,
°
C
0
Copper Area (mm
2
)
200
400
800
80
60
50
600
Once the value of P
IC(max)
is known, the maximum
permissible value of R
JA
can be calculated:
150
°
C
RJA
TA
PIC
(8)
The value of R
JA
can then be compared with those in the
package section of the data sheet. Those packages with
R
JA
’s less than the calculated value in equation 2 will keep
the die temperature below 150
°
C.
In some cases, none of the packages will be sufficient to
dissipate the heat generated by the IC, and an external
heatsink will be required.
Heat Sinks
A heat sink effectively increases the surface area of the
package to improve the flow of heat away from the IC and
into the surrounding air.
Each material in the heat flow path between the IC and the
outside environment will have a thermal resistance. Like
series electrical resistances, these resistances are summed to
determine the value of R
JA
:
RJA
RJC
RCS
where:
R
JC
= the junctiontocase thermal resistance,
R
CS
= the casetoheatsink thermal resistance, and
R
SA
= the heatsinktoambient thermal resistance.
R
JC
appears in the package section of the data sheet. Like
R
JA
, it too is a function of package type. R
CS
and R
SA
are
functions of the package type, heatsink and the interface
between them. These values appear in heat sink data sheets
of heat sink manufacturers.
RSA
(9)
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