參數(shù)資料
型號(hào): NCV2931
廠商: ON SEMICONDUCTOR
英文描述: 100 mA, Adjustable Output, LDO Voltage Regulator with 60 V Load Dump Protection(100mA,可調(diào)輸出,帶有60V負(fù)載保護(hù)的低壓差穩(wěn)壓器)
中文描述: 百毫安,可調(diào)輸出,LDO穩(wěn)壓器與60伏特拋負(fù)載保護(hù)(100mA的,可調(diào)輸出,帶有60V的負(fù)載保護(hù)的低壓差穩(wěn)壓器)
文件頁數(shù): 3/23頁
文件大?。?/td> 254K
代理商: NCV2931
LM2931, NCV2931 Series
http://onsemi.com
3
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Input Voltage Continuous
V
I
40
Vdc
Transient Input Voltage (
100 ms)
V
I
( )
60
Vpk
Transient Reverse Polarity Input Voltage
1.0% Duty Cycle,
100 ms
V
I
( )
50
Vpk
Electrostatic Discharge Sensitivity (ESD)
Human Body Model (HBM) Class 2, JESD22 A114C
Machine Model (MM) Class A, JESD22 A115A
Charged Device Model (CDM), JESD22 C101C
2000
200
2000
V
V
V
Power Dissipation
Case 29 (TO92 Type)
T
A
= 25
°
C
Thermal Resistance, JunctiontoAmbient
Thermal Resistance, JunctiontoCase
Case 221A, 314A, 314B and 314D (TO220 Type)
T
A
= 25
°
C
Thermal Resistance, JunctiontoAmbient
Thermal Resistance, JunctiontoCase
Case 318H (SOT223)
T
A
= 25
°
C
Thermal Resistance, JunctiontoAmbient
Thermal Resistance, JunctiontoCase
Case 369A (DPAK) (Note 1)
T
A
= 25
°
C
Thermal Resistance, JunctiontoAmbient
Thermal Resistance, JunctiontoCase
Case 751 (SOP8) (Note 2)
T
A
= 25
°
C
Thermal Resistance, JunctiontoAmbient
Thermal Resistance, JunctiontoCase
Case 936 and 936A (D
2
PAK) (Note 3)
T
A
= 25
°
C
Thermal Resistance, JunctiontoAmbient
Thermal Resistance, JunctiontoCase
Operating Ambient Temperature Range
P
D
R
JA
R
JC
Internally Limited
178
83
W
°
C/W
°
C/W
P
D
R
JA
R
JC
Internally Limited
65
5.0
W
°
C/W
°
C/W
P
D
R
JA
R
JC
Internally Limited
242
21
W
°
C/W
°
C/W
P
D
R
JA
R
JC
Internally Limited
92
6.0
W
°
C/W
°
C/W
P
D
R
JA
R
JC
Internally Limited
160
25
W
°
C/W
°
C/W
P
D
R
JA
R
JC
T
A
T
J
T
stg
Internally Limited
70
5.0
40 to +125
W
°
C/W
°
C/W
°
C
°
C
°
C
Operating Die Junction Temperature
+150
Storage Temperature Range
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. DPAK JunctiontoAmbient Thermal Resistance is for vertical mounting. Refer to Figure 25 for board mounted Thermal Resistance.
2. SOP8 JunctiontoAmbient Thermal Resistance is for minimum recommended pad size. Refer to Figure 24 for Thermal Resistance
variation versus pad size.
3. D
2
PAK JunctiontoAmbient Thermal Resistance is for vertical mounting. Refer to Figure 26 for board mounted Thermal Resistance.
65 to +150
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