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參數(shù)資料
| 型號： | NCP9002 |
| 廠商： | ON SEMICONDUCTOR |
| 英文描述： | 1.3 Watt Audio Power Amplifier with Fast Turn On Time |
| 中文描述： | 1.3瓦音頻功率放大器具有快速準時打開 |
| 文件頁數(shù)： | 3/13頁 |
| 文件大小： | 147K |
| 代理商： | NCP9002 |
NCP9002
http://onsemi.com
3
PIN DESCRIPTION
Pin
Type
Symbol
Description
A1
I
INM
Negative input of the first amplifier, receives the audio input signal. Connected to the
feedback resistor R
f
and to the input resistor R
in
.
A2
O
OUTA
Negative output of the NCP9002. Connected to the load and to the feedback resistor Rf.
A3
I
INP
Positive input of the first amplifier, receives the common mode voltage.
B1
I
VM_P
Power Analog Ground.
B2
I
VM
Core Analog Ground.
B3
I
V
p
Positive analog supply of the cell. Range: 2.2 V5.5 V.
C1
I
BYPASS
Bypass capacitor pin which provides the common mode voltage (Vp/2).
C2
O
OUTB
Positive output of the NCP9002. Connected to the load.
C3
I
SHUTDOWN
The device enters in shutdown mode when a low level is applied on this pin.
MAXIMUM RATINGS
(Note 1)
Rating
Symbol
Value
Unit
Supply Voltage
V
p
6.0
V
Operating Supply Voltage
Op Vp
2.2 to 5.5 V
2.0 V = Functional Only
Input Voltage
V
in
0.3 to Vcc +0.3
V
Max Output Current
Iout
500
mA
Power Dissipation (Note 2)
Pd
Internally Limited
Operating Ambient Temperature
T
A
40 to +85
°
C
Max Junction Temperature
T
J
150
°
C
Storage Temperature Range
T
stg
65 to +150
°
C
Thermal Resistance JunctiontoAir
R
JA
(Note 3)
°
C/W
ESD Protection
Human Body Model (HBM) (Note 4)
Machine Model (MM) (Note 5)
6000
>250
V
Latchup Current at T
A
= 85
°
C (Note 6)
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Maximum electrical ratings are defined as those values beyond which damage to the device may occur at T
A
= +25
°
C.
2. The thermal shutdown set to 160
°
C (typical) avoids irreversible damage on the device due to power dissipation. For further information see
page 9.
3. The R
JA
is highly dependent of the PCB Heatsink area. For example, R
JA
can equal 195
°
C/W with 50 mm
2
total area and also 135
°
C/W with
500 mm
2
. For further information see page 10. The bumps have the same thermal resistance and all need to be connected to optimize the power
dissipation.
4. Human Body Model, 100 pF discharge through a 1.5 k resistor following specification JESD22/A114.
5. Machine Model, 200 pF discharged through all pins following specification JESD22/A115.
6. Maximum ratings per JEDEC standard JESD78.
±
100
mA
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