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參數(shù)資料
| 型號： | NCP346SN2T1G |
| 廠商： | ON SEMICONDUCTOR |
| 元件分類： | 電源管理 |
| 英文描述： | Overvoltage Protection IC |
| 中文描述： | 1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO5 |
| 封裝： | LEAD FREE, TSOT-23, 5 PIN |
| 文件頁數(shù)： | 14/15頁 |
| 文件大?。?/td> | 386K |
| 代理商： | NCP346SN2T1G |
NCP346
http://onsemi.com
14
THIN SOT
23
5 POWER DISSIPATION
The power dissipation of the Thin SOT
23
5 is a function
of the pad size. This can vary from the minimum pad size for
soldering to a pad size given for maximum power
dissipation. Power dissipation for a surface mount device is
determined by T
J(max)
, the maximum rated junction
temperature of the die, R
JA
, the thermal resistance from the
device junction to ambient, and the operating temperature,
T
A
. Using the values provided on the data sheet for the
Thin SOT
23
5 package, P
D
can be calculated as follows:
T
J(max)
–T
A
P
D
R
JA
The values for the equation are found in the maximum
ratings table on the data sheet. Substituting these values into
the equation for an ambient temperature T
A
of 25
°
C, one can
calculate the power dissipation of the device which in this
case is 400 milliwatts.
150
°
C – 25
°
C
300
°
C W
The 300
°
C/W for the Thin SOT
23
5 package assumes
the use of the recommended footprint on a glass epoxy
printed circuit board to achieve a power dissipation of
417mw.
P
D
417 milliwatts
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