參數(shù)資料
型號: NCP2890AFCT2G
廠商: ON Semiconductor
文件頁數(shù): 10/16頁
文件大?。?/td> 0K
描述: IC AMP AUDIO POWER 1W 9-FLIPCHIP
標準包裝: 1
類型: AB 類
輸出類型: 1-通道(單聲道)
在某負載時最大輸出功率 x 通道數(shù)量: 1.08W x 1 @ 8 歐姆
電源電壓: 2.2 V ~ 5.5 V
特點: 消除爆音,差分輸入,短路和熱保護,關(guān)閉
安裝類型: 表面貼裝
供應(yīng)商設(shè)備封裝: 9-覆晶
封裝/外殼: 9-WFBGA,F(xiàn)CBGA
包裝: 剪切帶 (CT)
其它名稱: NCP2890AFCT2GOSCT
NCP2890, NCV2890
http://onsemi.com
3
PIN DESCRIPTION
9Pin FlipChip
CSP
Micro8
Type
Symbol
Description
A1
4
I
INM
Negative input of the first amplifier, receives the audio input signal. Connected to
the feedback resistor Rf and to the input resistor Rin.
A2
5
O
OUTA
Negative output of the NCP2890. Connected to the load and to the feedback
resistor Rf.
A3
3
I
INP
Positive input of the first amplifier, receives the common mode voltage.
B1
NA
I
VM_P
Power Analog Ground.
B2
7
I
VM
Core Analog Ground.
B3
6
I
Vp
Positive analog supply of the cell. Range: 2.2 V5.5 V.
C1
2
I
BYPASS
Bypass capacitor pin which provides the common mode voltage (Vp/2).
C2
8
O
OUTB
Positive output of the NCP2890. Connected to the load.
C3
1
I
SHUTDOWN
The device enters in shutdown mode when a low level is applied on this pin.
MAXIMUM RATINGS (Note 1)
Rating
Symbol
Value
Unit
Supply Voltage
Vp
6.0
V
Operating Supply Voltage
Op Vp
2.2 to 5.5 V
2.0 V = Functional Only
Input Voltage
Vin
0.3 to Vcc +0.3
V
Max Output Current
Iout
500
mA
Power Dissipation (Note 2)
Pd
Internally Limited
Operating Ambient Temperature
TA
40 to +85
°C
Max Junction Temperature
TJ
150
°C
Storage Temperature Range
Tstg
65 to +150
°C
Thermal Resistance JunctiontoAir
Micro8
9Pin FlipChip CSP
RqJA
230
(Note 3)
°C/W
ESD Protection
Human Body Model (HBM) (Note 4)
Machine Model (MM) (Note 5)
8000
>250
V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Maximum electrical ratings are defined as those values beyond which damage to the device may occur at TA = +25°C.
2. The thermal shutdown set to 160
°C (typical) avoids irreversible damage on the device due to power dissipation. For further information see
page 10.
3. For the 9Pin FlipChip CSP package, the RqJA is highly dependent of the PCB Heatsink area. For example, RqJA can equal 195°C/W with
50 mm2 total area and also 135
°C/W with 500 mm2. For further information see page 10. The bumps have the same thermal resistance and
all need to be connected to optimize the power dissipation.
4. Human Body Model, 100 pF discharge through a 1.5 k
W resistor following specification JESD22/A114.
5. Machine Model, 200 pF discharged through all pins following specification JESD22/A115.
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