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參數(shù)資料
| 型號： | NCN4557MTR2G |
| 廠商： | ON SEMICONDUCTOR |
| 元件分類： | 電源管理 |
| 英文描述： | 1.8 V/3.0 V Dual SIM/SAM/Smart Card Power Supply and Level Shifter |
| 中文描述： | 2-CHANNEL POWER SUPPLY SUPPORT CKT, QCC16 |
| 封裝： | 3 X 3 MM, 0.75 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, QFN-16 |
| 文件頁數(shù)： | 1/12頁 |
| 文件大?。?/td> | 181K |
| 代理商： | NCN4557MTR2G |
Semiconductor Components Industries, LLC, 2006
June, 2006 Rev. 0
1
Publication Order Number:
NCN4557/D
NCN4557
1.8 V/3.0 V Dual SIM/SAM/
Smart Card Power Supply
and Level Shifter
The NCN4557 is a dual interface analog circuit designed to
translate the voltages between SIM, SAM or Smart Cards and a
microcontroller (or similar control device). It integrates two LDOs
for power conversion and three level shifters per channel allowing
the management of two independent chip cards. The device fulfills
the ISO7816 and EMV smart card interface requirements as well as
the GSM and 3G mobile standard. Due to a builtin sequencer, the
device enables automatic activation and deactivation. Through the
ENABLE pin a low current shutdown mode can be activated
extending the battery life.
The card power supply voltage (1.8 V or 3.0 V) and the card socket
A or B are selected using two dedicated pins (SEL0 & SEL1).
Features
Supports 1.8 V or 3.0 V Operating SIM/SAM/Smart Cards
The LDOs are able to Supply more than 50 mA Under 1.8 V and
3.0 V
Builtin Active and Passive Pullup Resistor for I/O and
CRD_IOA/B Pins in Both Directions
All Pins are Fully ESD Protected According to ISO7816
Specifications – ESD Protection on Card Pins in Excess of 8.0 kV
(JEDEC HBM)
Builtin Sequencer for Activation and Deactivation
Supports up to more than 5.0 MHz Clock
Very Compact LowProfile 3x3 QFN16 Package
These are PbFree Devices*
Applications
SIM Card Interface Circuit for 2G, 2.5G and 3G Mobile Phones
Wireless PC/Laptop Cards (PCMCIA Cards)
POS Terminals (SAM Card Interfaces)
Smart Card Readers
*For additional information on our PbFree strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques Reference
Manual, SOLDERRM/D.
QFN16
MT SUFFIX
CASE 488AK
http://onsemi.com
MARKING
DIAGRAM
A
L
Y
W
G or
= Assembly Location
= Wafer Lot
= Year
= Work Week
= PbFree Package
NCN
4557
ALYWG
See detailed ordering and shipping information in the package
dimensions section on page 11 of this data sheet.
ORDERING INFORMATION
1
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