參數(shù)資料
型號(hào): NC7SP02L6X
廠商: Fairchild Semiconductor
文件頁數(shù): 9/9頁
文件大小: 0K
描述: IC GATE NOR ULP 2-INP 6-MICROPAK
產(chǎn)品變化通告: Die Material, Mold Compound Change 03/Oct/2008
標(biāo)準(zhǔn)包裝: 5,000
系列: 7SP
邏輯類型: 或非門
電路數(shù): 1
輸入數(shù): 2
電源電壓: 0.9 V ~ 3.6 V
電流 - 靜態(tài)(最大值): 0.9µA
輸出電流高,低: 2.6mA,2.6mA
邏輯電平 - 低: 0.7 V ~ 0.9 V
邏輯電平 - 高: 1.6 V ~ 2.1 V
額定電壓和最大 CL 時(shí)的最大傳播延遲: 7ns @ 3V ~ 3.6V,30pF
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
供應(yīng)商設(shè)備封裝: Micro6?(TSOP-6)
封裝/外殼: 6-UFDFN
包裝: 帶卷 (TR)
Technical Note
9/10
www.rohm.com
2013.11 - Rev.D
2011 ROHM Co., Ltd. All rights reserved.
BA5406,BA5417
Notes for use
1) Numbers and data in entries are representative design values and are not guaranteed values of the items.
2) Although ROHM is confident that the example application circuit reflects the best possible recommendations, be sure to
verify circuit characteristics for your particular application. Modification of constants for other externally connected circuits
may cause variations in both static and transient characteristics for external components as well as this Rohm IC. Allow for
sufficient margins when determining circuit constants.
3) Absolute maximum ratings
Use of the IC in excess of absolute maximum ratings, such as the applied voltage or operating temperature range (Topr),
may result in IC damage. Assumptions should not be made regarding the state of the IC (short mode or open mode) when
such damage is suffered. A physical safety measure, such as a fuse, should be implemented when using the IC at times
where the absolute maximum ratings may be exceeded.
4) GND potential
Ensure a minimum GND pin potential in all operating conditions. Make sure that no pins are at a voltage below the GND at
any time, regardless of whether it is a transient signal or not.
5) Thermal design
Perform thermal design, in which there are adequate margins, by taking into account the permissible dissipation (Pd) in
actual states of use.
6) Short circuit between terminals and erroneous mounting
Pay attention to the assembly direction of the ICs. Wrong mounting direction or shorts between terminals, GND, or other
components on the circuits, can damage the IC.
7) Operation in strong electromagnetic field
Using the ICs in a strong electromagnetic field can cause operation malfunction.
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