參數(shù)資料
型號(hào): NBSG53AMNR2
廠商: ON Semiconductor
文件頁數(shù): 9/18頁
文件大?。?/td> 0K
描述: IC FLIP FLOP DIFF CLOCK 16QFN
產(chǎn)品變化通告: Revision of Device Specifications 02/Oct/2008
標(biāo)準(zhǔn)包裝: 3,000
功能: 復(fù)位
類型: D 型總線
輸出類型: 差分
元件數(shù): 1
每個(gè)元件的位元數(shù): 2
頻率 - 時(shí)鐘: 8GHz
觸發(fā)器類型: 正,負(fù)
電源電壓: 2.375 V ~ 3.465 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 16-VFQFN 裸露焊盤
包裝: 帶卷 (TR)
其它名稱: NBSG53AMNR2OSTR
NBSG53A
http://onsemi.com
17
PACKAGE DIMENSIONS
FCBGA16
BA SUFFIX
PLASTIC 4 X 4 (mm) BGA FLIP CHIP PACKAGE
CASE 48901
ISSUE O
0.20
LASER MARK FOR PIN 1
IDENTIFICATION IN
THIS AREA
D
E
M
A1
A2
A
0.10 Z
0.15 Z
ROTATED 90 CLOCKWISE
DETAIL K
_
5
VIEW MM
e
3 X
S
M
X
0.15
Y
Z
0.08
Z
3
b
16 X
FEDUCIAL FOR PIN A1
IDENTIFICATION IN THIS AREA
43
21
A
B
C
D
4
16 X
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSION b IS MEASURED AT THE MAXIMUM
SOLDER BALL DIAMETER, PARALLEL TO DATUM
PLANE Z.
4. DATUM Z (SEATING PLANE) IS DEFINED BY THE
SPHERICAL CROWNS OF THE SOLDER BALLS.
5. PARALLELISM MEASUREMENT SHALL EXCLUDE
ANY EFFECT OF MARK ON TOP SURFACE OF
PACKAGE.
DIM
MIN
MAX
MILLIMETERS
A
1.40 MAX
A1
0.25
0.35
A2
1.20 REF
b
0.30
0.50
D
4.00 BSC
E
4.00 BSC
e
1.00 BSC
S
0.50 BSC
K
X
Y
M
Z
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