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參數(shù)資料
型號: NB6L72MNG
廠商: ON Semiconductor
文件頁數(shù): 5/11頁
文件大?。?/td> 0K
描述: IC CROSSPOINT SWITCH 2X2 16QFN
標(biāo)準(zhǔn)包裝: 123
功能: 交叉點開關(guān)
電路: 1 x 2:2
電壓電源: 單電源
電壓 - 電源,單路/雙路(±): 2.3 V ~ 3.6 V
電流 - 電源: 80mA
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 16-VFQFN 裸露焊盤
供應(yīng)商設(shè)備封裝: 16-QFN(3x3)
包裝: 管件
其它名稱: NB6L72MNG-ND
NB6L72MNGOS
NB6L72
http://onsemi.com
3
VTD1
D1
SEL1
GND
Q0
VCC
Q1
GND
SEL0
D0
VTD0
5
678
16
15
14
13
12
11
10
9
1
2
3
4
NB6L72
Exposed Pad (EP)
Figure 2. Pin Configuration (Top View)
Table 1. INPUT/OUTPUT SELECT TRUTH TABLE
SEL0*
SEL1*
Q0
Q1
L
D0
H
L
D1
D0
L
H
D0
D1
H
D1
*Defaults HIGH when left open
Table 2. PIN DESCRIPTION
Pin
Name
I/O
Description
1
SEL0
LVTTL, LVCMOS
Input
Select Logic Input control that selects D0 or D1 to output Q0. See Table 1, Select Input
Function Table. Pin defaults HIGH when left open
2
D0
LVPECL, CML,
LVDS, LVTTL,
LVCMOS, Input
Noninverted Differential Input. Note 1.
3
D0
LVPECL, CML,
LVDS, LVTTL,
LVCMOS, Input
Inverted Differential Input. Note 1.
4
VTD0
-
Internal 50
W Termination Pin. Note 1.
5
VTD1
-
Internal 50
W termination pin. Note 1.
6
D1
LVPECL, CML,
LVDS, LVTTL,
LVCMOS, Input
Noninverted Differential Input. Note 1.
7
D1
LVPECL, CML,
LVDS, LVTTL,
LVCMOS, Input
Inverted Differential Input. Note 1.
8
SEL1
LVTTL,LVCMOS
Input
Select Logic Input control that selects D0 or D1 to output Q1. See Table 1, Select Input
Function Table. Pin defaults HIGH when left open
9
GND
-
Negative Supply Voltage
10
Q1
LVPECL Output
Inverted Differential Output. Typically Terminated with 50
W Resistor to VCC - 2.0 V.
11
Q1
LVPECL Output
Noninverted Differential Output. Typically Terminated with 50
W Resistor to VCC - 2.0 V.
12
VCC
-
Positive Supply Voltage
13
VCC
-
Positive Supply Voltage
14
Q0
LVPECL Output
Inverted Differential Reset Input. Typically Terminated with 50
W Resistor to VCC - 2.0 V.
15
Q0
LVPECL Output
Noninverted Differential Reset Input. Typically Terminated with 50
W Resistor to VCC - 2.0 V.
16
GND
-
Negative Supply Voltage
-
EP
-
The Exposed Pad (EP) on the QFN-16 package bottom is thermally connected to the die for
improved heat transfer out of package. The exposed pad must be attached to a heat-sinking
conduit. The pad is not electrically connected to the die, but is recommended to be
electrically and thermally connected to GND on the PC board.
1. In the differential configuration when the input termination pin (VTDn, VTDn) are connected to a common termination voltage or left open,
and if no signal is applied on Dn/Dn input, then the device will be susceptible to self-oscillation.
2. All VCC and GND pins must be externally connected to a power supply for proper operation.
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