NB3L553
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3
Table 3. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
Condition 2
Rating
Unit
VDD
Positive Power Supply
GND = 0 V
6.0
V
VI
Input Voltage
OE
ICLK
GND = 0 V and
VDD = 2.375 V to 5.25 V
GND – 0.5 v VI v VDD + 0.5
GND – 0.5 v VI v 5.75
V
TA
Operating Temperature Range,
Industrial
≥ 40 to ≤ +85
°C
Tstg
Storage Temperature Range
65 to +150
°C
qJA
Thermal Resistance
(JunctiontoAmbient)
0 lfpm
500 lfpm
SOIC8
190
130
°C/W
qJC
Thermal Resistance (JunctiontoCase)
SOIC8
41 to 44
°C/W
qJA
Thermal Resistance
(JunctiontoAmbient)
0 lfpm
500 lfpm
DFN8
129
84
°C/W
qJC
Thermal Resistance (JunctiontoCase)
DFN8
35 to 40
°C/W
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. JEDEC standard multilayer board 2S2P (2 signal, 2 power)
Table 4. ATTRIBUTES
Characteristic
Value
ESD Protection
Human Body Model
Machine Model
Charged Device Model
> 2 kV
> 150 V
> TBD kV
Moisture Sensitivity, Indefinite Time Out of Drypack (Note
2)Level 1
Flammability Rating
Oxygen Index: 28 to 34
UL94 code V0 @ 0.125 in
Transistor Count
531 Devices
Meets or Exceeds JEDEC Standard EIA/JESD78 IC Latchup Test
2. For additional Moisture Sensitivity information, refer to Application Note AND8003/D.