參數(shù)資料
型號： MVUPS760E3
廠商： MICROSEMI CORP-SCOTTSDALE
元件分類： 整流器
英文描述： 7 A, 60 V, SILICON, RECTIFIER DIODE
封裝： ROHS COMPLIANT, PLASTIC, POWERMITE 3, 2 PIN
文件頁數(shù)： 1/5頁
文件大小： 263K
代理商： MVUPS760E3
UPS760e3
7 A Schottky Barrier Rectifier
Microsemi
Copyright
2005
5-31-2005 Rev 0
WWW
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DESCRIPTION
This UPS760e3 in the Powermite3
package is a high efficiency Schottky
rectifier that is also RoHS compliant offering high current/power capabilities
previously found only in much larger packages. They are ideal for SMD
applications that operate at high frequencies.
In addition to its size
advantages, the Powermite3
package includes a full metallic bottom that
eliminates the possibility of solder flux entrapment during assembly and a
unique locking tab. This acts as an efficient heat path to the heat-sink
mounting.
Its innovative design makes this device ideal for use with
automatic insertion equipment.
IMPORTANT: Forthemostcurrentdata,consultMICROSEMI’s website: http://www.microsemi.com
ABSOLUTE MAXIMUM RATINGS AT 25 C
(UNLESS OTHERWISE SPECIFIED)
Rating
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
60
V
RMS Reverse Voltage
VR(RMS)
42
V
Average Rectified Output Current
Io
7
A
Non-Repetitive Peak Forward Surge Current
8.3ms Single half sine wave Superimposed
on Rated Load@ Tc =90 C
IFSM
100
A
Storage Temperature
TSTG
-55 to +150
C
Junction Temperature
TJ
-55 to +125
C
THERMAL CHARACTERISTICS
(UNLESS OTHERWISE SPECIFIED)
Thermal Resistance
Junction to Case (Bottom)
RθJC
2.5
C/Watt
Junction to Ambient (1)
RθJA
65
C/Watt
(1) When mounted on FR-4 PC board using 2 oz copper with recommended minimum foot print.
KEY FEATUR ES
Very low thermal resistance package
RoHS Compliant with e3 suffix part number
Guard-ring-die construction for transient
protection
Efficient heat path with Integral locking
bottom metal tab
Low forward voltage
Full metallic bottom eliminates flux
entrapment
Compatible with automatic insertion
Low profile-maximum height of 1mm
Options for screening in accordance with
MIL-PRF-19500 for JAN, JANTX, JANTXV,
and JANS are available by adding MQ, MX,
MV, or MSP prefixes respectively to part
numbers. For example, designate
MXUPS760e3 for a JANTX (consult factory
for Tin-Lead plating).
Optional 100% avionics screening available
by adding MA prefix for 100% temperature
cycle, thermal impedance and 24 hours
HTRB (consult factory for Tin-Lead plating)
APPLICATIONS/BENEFITS
Switching and Regulating Power Supplies
Silicon Schottky (hot carrier) rectifier for
minimal reverse voltage recovery
Elimination of reverse-recovery oscillations
to reduce need for EMI filtering
Charge Pump Circuits
Reduces reverse recovery loss with low IRM
Small foot print
190 X 270 mils (1:1 Actual size)
See mounting pad details on pg 3
MECHANICAL & PACKAGING
CASE: Void-free transfer molded
thermosetting epoxy compound meeting
UL94V-0
FINISH: Annealed matte-Tin plating over
copper and readily solderable per MIL-
STD-750 method 2026 (consult factory for
Tin-Lead plating)
POLARITY: See figure (left)
MARKING: S760
WEIGHT: 0.072 gram (approx.)
Package dimension on last page
Tape & Reel option: 16 mm tape per
Standard EIA-481-B, 5000 on 13” reel
Page 1
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