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參數(shù)資料
| 型號(hào)： | MURB1660CT |
| 廠商： | ON SEMICONDUCTOR |
| 元件分類： | 參考電壓二極管 |
| 英文描述： | SWITCHMODE Ultrafast Power Rectifier(16A,600V,SWITCHMODE超快功率整流器) |
| 中文描述： | 8 A, 600 V, SILICON, RECTIFIER DIODE |
| 封裝： | PLASTIC, CASE 418B-04, D2PAK-3 |
| 文件頁(yè)數(shù)： | 5/8頁(yè) |
| 文件大小： | 67K |
| 代理商： | MURB1660CT |
MURB1660CT
http://onsemi.com
5
RECOMMENDED PROFILE FOR REFLOW SOLDERING
For any given circuit board, there will be a group of
control settings that will give the desired heat pattern. The
operator must set temperatures for several heating zones,
and a figure for belt speed. Taken together, these control
settings make up a heating “profile” for that particular
circuit board. On machines controlled by a computer, the
computer remembers these profiles from one operating
session to the next. Figure 7 shows a typical heating profile
for use when soldering the D
2
PAK to a printed circuit
board. This profile will vary among soldering systems but it
is a good starting point. Factors that can affect the profile
include the type of soldering system in use, density and
types of components on the board, type of solder used, and
the type of board or substrate material being used. This
profile shows temperature versus time. The line on the
graph shows the actual temperature that might be
experienced on the surface of a test board at or near a
central solder joint. The two profiles are based on a high
density and a low density board. The Vitronics SMD310
convection/infrared reflow soldering system was used to
generate this profile. The type of solder used was 62/36/2
Tin Lead Silver with a melting point between 177–189
°
C.
When this type of furnace is used for solder reflow work,
the circuit boards and solder joints tend to heat first. The
components on the board are then heated by conduction.
The circuit board, because it has a large surface area,
absorbs the thermal energy more efficiently, then
distributes this energy to the components. Because of this
effect, the main body of a component may be up to 30
degrees cooler than the adjacent solder joints.
STEP 1
PREHEAT
ZONE 1
RAMP"
STEP 2
VENT
SOAK"
STEP 3
HEATING
ZONES 2 & 5
RAMP"
STEP 4
HEATING
ZONES 3 & 6
SOAK"
STEP 5
HEATING
ZONES 4 & 7
SPIKE"
170
°
C
STEP 6
VENT
STEP 7
COOLING
200
°
C
150
°
C
100
°
C
50
°
C
TIME (3 TO 7 MINUTES TOTAL)
T
MAX
SOLDER IS LIQUID FOR
40 TO 80 SECONDS
(DEPENDING ON
MASS OF ASSEMBLY)
205
°
TO
219
°
C
PEAK AT
SOLDER
JOINT
DESIRED CURVE FOR LOW
MASS ASSEMBLIES
DESIRED CURVE FOR HIGH
MASS ASSEMBLIES
100
°
C
150
°
C
160
°
C
140
°
C
Figure 7. Typical Solder Heating Profile for D
2
PAK
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| MURD330T4 | SWITCHMODE Power Rectifier(開(kāi)關(guān)模式功率整流管) |
| MURF1660CT | SWITCHMODE Power Rectifier(開(kāi)關(guān)模式功率整流管) |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MURB1660CT/D | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:SWITCHMODE? Power Rectifier |
| MURB1660CT_06 | 制造商:ONSEMI 制造商全稱:ON Semiconductor 功能描述:ULTRAFAST RECTIFIER 16 AMPERES, 600 VOLTS |
| MURB1660CTG | 功能描述:整流器 600V 16A Ultrafast RoHS:否 制造商:Vishay Semiconductors 產(chǎn)品:Standard Recovery Rectifiers 配置: 反向電壓:100 V 正向電壓下降: 恢復(fù)時(shí)間:1.2 us 正向連續(xù)電流:2 A 最大浪涌電流:35 A 反向電流 IR:5 uA 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DO-221AC 封裝:Reel |
| MURB1660CTT4 | 功能描述:整流器 600V 16A Ultrafast RoHS:否 制造商:Vishay Semiconductors 產(chǎn)品:Standard Recovery Rectifiers 配置: 反向電壓:100 V 正向電壓下降: 恢復(fù)時(shí)間:1.2 us 正向連續(xù)電流:2 A 最大浪涌電流:35 A 反向電流 IR:5 uA 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DO-221AC 封裝:Reel |
| MURB1660CTT4G | 功能描述:整流器 600V 16A Ultrafast RoHS:否 制造商:Vishay Semiconductors 產(chǎn)品:Standard Recovery Rectifiers 配置: 反向電壓:100 V 正向電壓下降: 恢復(fù)時(shí)間:1.2 us 正向連續(xù)電流:2 A 最大浪涌電流:35 A 反向電流 IR:5 uA 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DO-221AC 封裝:Reel |
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