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參數(shù)資料
| 型號： | MT55L64L36F1 |
| 廠商： | Micron Technology, Inc. |
| 英文描述： | 64K x 36,3.3V I/O, ZBT SRAM(2Mb,3.3V輸入/輸出，靜態(tài)RAM) |
| 中文描述： | 64K的x 36,3.3六/ O的ZBT SRAM的（處理器，3.3V的輸入/輸出，靜態(tài)內(nèi)存） |
| 文件頁數(shù)： | 10/23頁 |
| 文件大小： | 406K |
| 代理商： | MT55L64L36F1 |
10
2Mb: 128K x 18, 64K x 32/36 3.3V I/O, Flow-Through ZBT SRAM
MT55L128L18F1_2.p65
–
Rev. 8/00
Micron Technology, Inc., reserves the right to change products or specifications without notice.
2000, Micron Technology, Inc.
2Mb: 128K x 18, 64K x 32/36
3.3V I/O, FLOW-THROUGH ZBT SRAM
FBGA PIN DESCRIPTIONS (continued)
x18
x32/x36
SYMBOL
V
SS
TYPE
Supply Ground:
GND.
DESCRIPTION
1H, 4C, 4N, 5C, 1H, 4C, 4N, 5C,
5D, 5E 5F,
5G, 5H, 5J,
5K, 5L, 5M,
6C,
6D,
6E,
6F, 6C,
6D,
6E,
6F,
6G, 6H, 6J,
6K, 6L, 6M,
7C, 7D, 7E,
7F, 7G, 7H,
7J, 7K, 7L,
7M, 7N, 8C, 8N 7M, 7N, 8C, 8N
5P, 5R, 7P, 7R 5P, 5R, 7P, 7R
5D, 5E 5F,
5G, 5H, 5J,
5K, 5L, 5M,
6G, 6H, 6J,
6K, 6L, 6M,
7C, 7D, 7E,
7F, 7G, 7H,
7J, 7K, 7L,
DNU
–
Do Not Use: These signals may either be unconnected or wired to
GND to improve package heat dissipation.
No Connect: These signals are not internally connected and
may be connected to ground to improve package heat
dissipation.
1A, 1B, 1C,
1D, 1E, 1F,
1G, 1P, 2C,
2J, 2K, 2L,
2M, 2N, 2P,
2R, 3H, 4B,
5A, 5N, 6N,
9A, 9B, 9H,
10C, 10D, 10E,
10F, 10G,
10H, 10N,
11B, 11J,
11K, 11L,
11M, 11N,
11P, 11R
1A, 1B, 1P,
2C, 2N, 2P,
2R, 3H, 5N,
6N, 9A, 9B,
9H, 10C,
10H, 10N,
11A, 11B,
11P, 11R
NC
–
NOTE:
Pins 11R, 9A, and 9B are reserved for address expansion; 4Mb, 8Mb, and 16Mb respectively.
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相關(guān)代理商/技術(shù)參數(shù) |
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| MT55L64L36F1T-12 | 制造商:Cypress Semiconductor 功能描述:64KX36 SRAM PLASTIC TQFP 3.3V |
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| MT55V1MV18FT-10 | 制造商:Rochester Electronics LLC 功能描述:- Bulk 制造商:Micron Technology Inc 功能描述: |
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| MT55V1MV18PT-10 | 制造商:Rochester Electronics LLC 功能描述:- Bulk 制造商:Micron Technology Inc 功能描述: |
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