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參數(shù)資料
| 型號(hào)： | MT55L512L18P-1 |
| 廠商： | Micron Technology, Inc. |
| 英文描述： | IBM AT-AT NULL MODEM CABL15 FT FF |
| 中文描述： | 8MB的ZBT SRAM的 |
| 文件頁(yè)數(shù)： | 11/30頁(yè) |
| 文件大?。?/td> | 497K |
| 代理商： | MT55L512L18P-1 |
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11
8Mb: 512K x 18, 256K x 32/36 Pipelined ZBT SRAM
MT55L512L18P_2.p65
–
Rev. 6/01
Micron Technology, Inc., reserves the right to change products or specifications without notice.
2001, Micron Technology, Inc.
8Mb: 512K x 18, 256K x 32/36
PIPELINED ZBT SRAM
x18
x32/x36
4C, 4N, 5C,
SYMBOL
V
SS
TYPE
Supply Ground:
GND.
DESCRIPTION
4C, 4N, 5C,
5D, 5E, 5F, 5G, 5D, 5E, 5F, 5G,
5H, 5J, 5K, 5L, 5H, 5J, 5K, 5L,
5M, 6C, 6D,
6E, 6F, 6G, 6H, 6E, 6F, 6G, 6H,
6J, 6K, 6L, 6M, 6J, 6K, 6L, 6M,
7C, 7D, 7E, 7F, 7C, 7D, 7E, 7F,
7G, 7H, 7J, 7K, 7G, 7H, 7J, 7K,
7L, 7M, 8C, 8N 7L, 7M, 8C, 8N
5P, 7P, 5R, 7R 5P, 7P, 5R, 7R
5M, 6C, 6D,
DNU
–
Do Not Use: These signals may either be unconnected or wired to
GND to improve package heat dissipation.
No Connect: These signals are not internally connected and may be
connected to ground to improve package heat dissipation.
Pin 9B is reserved for address pin expansion; 16MB.
1A, 1B, 1C, 1D,
1E, 1F, 1G,
1P, 2C, 2J, 2K,
2L, 2M, 2N,
2P, 2R, 3H, 4B, 10C, 10H, 10N,
5A, 5N, 6N,
9B, 9H, 10C,
10D, 10E, 10F,
10G, 10H, 10N,
11B, 11J, 11K,
11L, 11M,
11N, 11P
1A, 1B, 1P,
2C, 2N, 2P,
2R, 3H, 5N,
6N, 9B, 9H,
NC
–
11A, 11B, 11P
NF
—
No Function: These pins are internally connected to the die and
have the capacitance of an input pin. It is allowable to leave
these pins unconnected or driven by signals.
FBGA PIN DESCRIPTIONS (CONTINUED)
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MT55L512L18PF-7.5 | 制造商:Cypress Semiconductor 功能描述:8MB 512KX18 SRAM PLASTIC FBGA |
| MT55L512V18P | 制造商:MICRON 制造商全稱(chēng):Micron Technology 功能描述:8Mb ZBT SRAM |
| MT55L512Y32PF-10 | 制造商:Micron Technology Inc 功能描述: |
| MT55L512Y32PT-10 | 制造商:Rochester Electronics LLC 功能描述:- Bulk 制造商:Micron Technology Inc 功能描述: |
| MT55L512Y32PT-6 | 制造商:Rochester Electronics LLC 功能描述:- Bulk 制造商:Micron Technology Inc 功能描述: |
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