參數(shù)資料
型號： MSPUPS160E3
廠商： MICROSEMI CORP
元件分類： 二極管(射頻、小信號、開關(guān)、功率)
英文描述： 1 A, 60 V, SILICON, SIGNAL DIODE, DO-216AA
封裝： ROHS COMPLIANT, PLASTIC, DO-216, POWERMITE, 2 PIN
文件頁數(shù)： 1/2頁
文件大?。?/td> 134K
代理商： MSPUPS160E3
UPS160e3
1.0 A Schottky Barrier Rectifier
DESCRIPTION
The Microsemi UPS160e3 Powermite
Schottky rectifier is RoHS
compliant and offers optimized forward voltage characteristics with reverse
blocking capabilities up to 60 Volt. They are ideal for surface mount
applications that operate at high frequencies.
In addition to its size advantages, Powermite
package features include a
full metallic bottom that eliminates possibility of solder flux entrapment
during assembly, and a unique locking tab acts as an efficient heat path
from die to mounting plane for external heat sinking with very low thermal
resistance junction to case (bottom). Its innovative design makes this
device ideal for use with automatic insertion equipment.
IMPORTANT: Forthemostcurrentdata,consultMICROSEMI’s website: http://www.microsemi.com
ABSOLUTE MAXIMUM RATINGS AT 25 C
(UNLESS OTHERWISE SPECIFIED)
Rating
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
60
V
RMS Reverse Voltage
V R (RMS)
42
V
Average Rectified Output Current
Io
1.0
A
Non-Repetitive Peak Forward Surge Current
8.3ms Single half sine wave Superimposed
on Rated Load@ Tc =90 C
IFSM
25
A
Storage Temperature
T
stg
-65 to +150
C
Junction Temperature
T J
-65 to +125
C
DO-216
See further details and dimensions on last page
THERMAL CHARACTERISTICS
(UNLESS OTHERWISE SPECIFIED)
Thermal Resistance
Junction-to-case (bottom)
RθJC
15
C/ Watt
Junction-to-ambient (1)
RθJA
240
C/ Watt
(1) When mounted on FR-4 PC board using 1 oz copper with recommended minimum foot print
KEY FEATUR ES
Low thermal resistance DO-216 package
RoHS Compliant with e3 suffix part number
Guard-ring-die construction for transient
protection
Efficient heat path with Integral locking
bottom metal tab
Low forward voltage
Full metallic bottom eliminates flux
entrapment
Compatible with automatic insertion
Low profile-maximum height of 1mm
Options for screening in accordance with
MIL-PRF-19500 for JAN, JANTX, JANTXV,
and JANS are available by adding MQ, MX,
MV, or MSP prefixes respectively to part
numbers. For example, designate
MXUPS160e3 for a JANTX (consult factory
for Tin-Lead plating).
Optional 100% avionics screening available
by adding MA prefix for 100% temperature
cycle, thermal impedance and 24 hours
HTRB (consult factory for Tin-Lead plating)
APPLICATIONS/BENEFITS
Switching and Regulating Power Supplies.
Silicon Schottky (hot carrier) rectifier for
minimal reverse voltage recovery
Elimination of reverse-recovery oscillations
to reduce need for EMI filtering
Charge Pump Circuits
Reduces reverse recovery loss with low IRM
Small 8.45 mm
2 foot print
(See mounting pad details next page)
MECHANICAL & PACKAGING
CASE: Void-free transfer molded
thermosetting epoxy compound meeting
UL94V-0
FINISH: Annealed matte-Tin plating over
copper and readily solderable per MIL-
STD-750 method 2026 (consult factory for
Tin-Lead plating)
POLARITY: See figure (left)
MARKING: S60
WEIGHT: 0.016 grams (approx.)
Package dimension on last page
Tape & Reel option: 12 mm tape per
Standard EIA-481-B, 3000 on 7 inch reel
and 12,000 on 13” reel
WWW
.Microse
m
i
.CO
M
UU
PP
SS
11
66
00
EE
33
Microsemi
Copyright
2005
8-03-2005 Rev A
Page 1
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