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參數(shù)資料
| 型號： | MSPUPS1040CTE3 |
| 廠商： | MICROSEMI CORP-SCOTTSDALE |
| 元件分類： | 整流器 |
| 英文描述： | 10 A, 40 V, SILICON, RECTIFIER DIODE |
| 封裝： | ROHS COMPLIANT, PLASTIC, POWERMITE3, 2 PIN |
| 文件頁數(shù)： | 1/6頁 |
| 文件大小： | 283K |
| 代理商： | MSPUPS1040CTE3 |
UPS1040CTe3
10 A Dual Schottky Barrier Rectifiers
DESCRIPTION
This UPS1040CTe3 in the Powermite3
package is a high efficiency center-
tap dual Schottky rectifier that is also RoHS compliant offering high
current/power capabilities previously found only in much larger packages.
They are ideal for SMD applications that operate at high frequencies. In
addition to its size advantages, the Powermite3
package includes a full
metallic bottom that eliminates the possibility of solder flux entrapment
during assembly and a unique locking tab act as an efficient heat path to the
heat-sink mounting. Its innovative design makes this device ideal for use
with automatic insertion equipment.
IMPORTANT: Forthemostcurrentdata,consultMICROSEMI’s website: http://www.microsemi.com
ABSOLUTE MAXIMUM RATINGS AT 25 C
(UNLESS OTHERWISE SPECIFIED)
Rating
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
40
V
RMS Reverse Voltage
V R (RMS)
28
V
Average Rectified Output Current
Io
10
A
Non-Repetitive Peak Forward Surge Current
8.3ms Single half sine wave Superimposed
on Rated Load@ Tc =90 C
IFSM
150
A
Storage Temperature
TSTG
-55 to +150
C
Junction Temperature
TJ
-55 to +125
C
THERMAL CHARACTERISTICS
(UNLESS OTHERWISE SPECIFIED)
Thermal Resistance (dual device)
Junctions-to Bottom (Case)
RθJC
2.5
C/Watt
KEY FEATURES
Very low thermal resistance package
Dual center-tap Schottky configuration with
common cathode
RoHS Compliant with e3 suffix part number
Guard-ring-die construction for transient
protection
Efficient heat path with Integral locking bottom
metal tab
Low forward voltage
Full metallic bottom eliminates flux entrapment
Compatible with automatic insertion
Low profile-maximum height of 1mm
Options for screening in accordance with MIL-
PRF-19500 for JAN, JANTX, JANTXV, and
JANS are available by adding MQ, MX, MV, or
MSP prefixes respectively to part numbers.
For example, designate MXUPS1040CTe3 for
a JANTX (consult factory for Tin-Lead plating).
Optional 100% avionics screening available by
adding MA prefix for 100% temperature cycle,
thermal impedance and 24 hours HTRB
(consult factory for Tin-Lead plating)
APPLICATIONS/BENEFITS
Switching and Regulating Power supplies.
Silicon Schottky (hot carrier) rectifier for
minimal reverse voltage recovery
Elimination of reverse-recovery oscillations to
reduce need for EMI filtering
Charge Pump Circuits
Reduces reverse recovery loss with low IRM
Small foot print
190 X 270 mils (1:1 Actual size)
See mounting pad details on pg 5
MECHANICAL & PACKAGING
CASE: Void-free transfer molded
thermosetting epoxy compound meeting
UL94V-0
FINISH: Annealed matte-Tin plating over
copper and readily solderable per MIL-STD-
750 method 2026 (consult factory for Tin-Lead
plating)
POLARITY: See figure (left)
MARKING: S1040CT
WEIGHT: 0.072 gram (approx.)
Package dimension on last page
Tape & Reel option: 16 mm tape per Standard
EIA-481-B, 5000 on 13” reel
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Copyright
2005
5/17/2005 Rev B
Page 1
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