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參數(shù)資料
| 型號： | MSP50P37 |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | Mixed -Signal Microprocessor(混合信號微處理器) |
| 中文描述： | 混合信號微處理器（混合信號微處理器） |
| 文件頁數(shù)： | 1/9頁 |
| 文件大?。?/td> | 142K |
| 代理商： | MSP50P37 |
MSP50C32, MSP50C33, MSP50C34
MSP50P34, MSP50C37, MSP50P37
MIXED-SIGNAL PROCESSORS
SPSS019A – MAY 1997 – REVISED OCTOBER 1998
3
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
Dual Programmable LPC-12 Speech
Synthesizers
Simultaneous LPC and PCM Waveforms
8-Bit Microprocessor with 61 instructions
32 Twelve-Bit Words and 224 Bytes of RAM
3.3V to 6.5V CMOS Technology for Low
Power Dissipation
Direct Speaker Drive Capability
Mask Selectable Internal or External Clock
Internal Clock Generator that Requires No
External Components
Two Software-Selectable Clock Speeds
10-kHz or 8-kHz Speech Sample Rate
description
The MSP50x3x family uses a revolutionary architecture to combine an 8-bit microprocessor, two speech
synthesizers, ROM, RAM, and I/O in a low-cost single-chip system. The architecture uses the same arithmetic
logic unit (ALU) for the two synthesizers and the microprocessor, thus reducing chip area and cost and enabling
the microprocessor to do a multiply operation in 0.8
μ
s. The MSP50x3x family features two independent
channels of linear predictive coding (LPC), which synthesize high-quality speech at a low data rate. Pulse-code
modulation (PCM) can produce music or sound effects. LPC and PCM can be added together to produce a
composite result. For more information, see the MSP50x3x User’s Guide (literature number SPSU006).
Table 1. MSP50x3x Family
DEVICE
AMOUNT OF ROM/PROM
FEATURES
MSP50C32
16K bytes mask ROM
9/10 I/O lines
MSP50C33
32K bytes mask ROM
9/10 I/O lines
MSP50C34
64K bytes mask ROM
9/10 I/O lines, 24 I/O lines in die form
MSP50P34
64K bytes PROM
9/10 I/O lines
MSP50C37
16K bytes mask ROM
18 I/O lines, A/D converter/analog amplifier
MSP50P37
16K bytes PROM
18 I/O lines, A/D converter/analog amplifier
Copyright
1998, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
N PACKAGE
(TOP VIEW)
OSC IN
PA6
PA5
PA4
PA3
PA2
PA1
PB1/OSC OUT
PA7
PB0
PA0
DAC+
DAC–
V
DD
V
SS
INIT
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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