• 參數資料
    型號: MSM65512A-XXXRS
    廠商: LAPIS SEMICONDUCTOR CO LTD
    元件分類: 微控制器/微處理器
    英文描述: 8-BIT, MROM, 10 MHz, MICROCONTROLLER, PDIP40
    封裝: 0.600 INCH, 2.54 MM PITCH, PLASTIC, DIP-40
    文件頁數: 15/24頁
    文件大?。?/td> 219K
    代理商: MSM65512A-XXXRS
    21/23
    Semiconductor
    MSM65512A/65P512A
    (Unit : mm)
    PACKAGE DIMENSIONS
    Notes for Mounting the Surface Mount Type Package
    The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
    are very susceptible to heat in reflow mounting and humidity absorbed in storage.
    Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
    product name, package name, pin number, package code and desired mounting conditions
    (reflow method, temperature and times).
    DIP40-P-600-2.54
    Package material
    Lead frame material
    Pin treatment
    Solder plate thickness
    Package weight (g)
    Epoxy resin
    42 alloy
    Solder plating
    5 mm or more
    6.10 TYP.
    相關PDF資料
    PDF描述
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