![](http://datasheet.mmic.net.cn/180000/MSK5910ERH_datasheet_11333911/MSK5910ERH_4.png)
APPLICATION NOTES CONT.
4
Rev. O 12/09
HEAT SINK SELECTION
To select a heat sink for the MSK 5910RH, the follow-
ing formula for convective heat flow may be used.
Governing Equation:
TJ = PD X (RθJC + RθCS + RθSA) + TA
Where
TJ
= Junction Temperature
PD
= Total Power Dissipation
RθJC = Junction to Case Thermal Resistance
RθCS = Case to Heat Sink Thermal Resistance
RθSA = Heat Sink to Ambient Thermal Resistance
TA
= Ambient Temperature
Power Dissipation=(VIN-VOUT) x IOUT
Next, the user must select a maximum junction tem-
perature. The absolute maximum allowable junction tem-
perature is 150°C. The equation may now be rearranged
to solve for the required heat sink to ambient thermal
resistance (RθSA).
Example:
An MSK 5910RH is connected for VIN=+5V and
VOUT=+3.3V. IOUT is a continuous 1A DC level. The
ambient temperature is +25°C. The maximum desired
junction temperature is +125°C.
RθJC=8.5°C/W and RθCS=0.15°C/W for most thermal
greases
Power Dissipation=(5V-3.3V) x (1A)
=1.7Watts
Solve for RθSA:
125°C - 25°C
1.7W
= 50.3°C/W
In this example, a heat sink with a thermal resistance
of no more than 50°C/W must be used to maintain a
junction temperature of no more than 125°C.
VOUT=1.265(1+R1/R2)
OUTPUT VOLTAGE SELECTION
As noted in the above typical applications circuit,
the formula for output voltage selection is
A good starting point for this output voltage selection is
to set R2=1K. By rearranging the formula it is simple to
calculate the final R1 value.
Table 1 below lists some of the most probable resistor
combinations based on industry standard usage.
R1
R2
1+
VOUT=1.265
VOUT
1.265 -1
R1=R2
RθSA=
-8.4°C/W - 0.15°C/W
TYPICAL APPLICATIONS CIRCUIT
THERMAL LIMITING
The MSK 5910RH control circuitry has a thermal shut-
down temperature of approximately 150°C. This ther-
mal shutdown can be used as a protection feature, but
for continuous operation, the junction temperature of the
pass transistor must be maintained below 150°C. Proper
heat sink selection is essential to maintain these condi-
tions. Exceeding the thermal limit activates the latch fea-
ture of the MSK 5910RH. See LATCH pin description for
instructions to reset the latch or disable the latch fea-
ture.
1.5
1.8
2.0
2.5
2.8
3.3
4.0
5.0
1K
187
422
576
976
1.21K
1.62K
2.15K
2.94K
OUTPUT VOLTAGE
(V)
TABLE 1
R2
(
)
R1 (nearest 1%)
(
)
Radiation performance curves for TID testing have been
generated for all radiation testing performed by MS
Kennedy. These curves show performance trends
throughout the TID test process and can be located in
the MSK 5910RH radiation test report. The complete
radiation test report is available in the RAD HARD PROD-
UCTS section on the MSK website.
TOTAL DOSE RADIATION TEST
PERFORMANCE
http://www.mskennedy.com/store.asp?pid=9951&catid=19680