參數(shù)資料
型號: MSA1022-CT3
廠商: MOTOROLA INC
元件分類: 小信號晶體管
英文描述: UHF BAND, Si, PNP, RF SMALL SIGNAL TRANSISTOR
封裝: SC-59, 3 PIN
文件頁數(shù): 30/32頁
文件大?。?/td> 287K
代理商: MSA1022-CT3
Packaging Specifications
6–6
Motorola Small–Signal Transistors, FETs and Diodes Device Data
TO–92 EIA RADIAL TAPE IN FAN FOLD BOX OR ON REEL
H2A
H
F1
F2
P2
P1
P
D
W
W1
L1
W2
H2B
T1
T
T2
H4 H5
H1
Figure 1. Device Positioning on Tape
L
Specification
Inches
Millimeter
Symbol
Item
Min
Max
Min
Max
D
Tape Feedhole Diameter
0.1496
0.1653
3.8
4.2
D2
Component Lead Thickness Dimension
0.015
0.020
0.38
0.51
F1, F2
Component Lead Pitch
0.0945
0.110
2.4
2.8
H
Bottom of Component to Seating Plane
.059
.156
1.5
4.0
H1
Feedhole Location
0.3346
0.3741
8.5
9.5
H2A
Deflection Left or Right
0
0.039
0
1.0
H2B
Deflection Front or Rear
0
0.051
0
1.0
H4
Feedhole to Bottom of Component
0.7086
0.768
18
19.5
H5
Feedhole to Seating Plane
0.610
0.649
15.5
16.5
L
Defective Unit Clipped Dimension
0.3346
0.433
8.5
11
L1
Lead Wire Enclosure
0.09842
2.5
P
Feedhole Pitch
0.4921
0.5079
12.5
12.9
P1
Feedhole Center to Center Lead
0.2342
0.2658
5.95
6.75
P2
First Lead Spacing Dimension
0.1397
0.1556
3.55
3.95
T
Adhesive Tape Thickness
0.06
0.08
0.15
0.20
T1
Overall Taped Package Thickness
0.0567
1.44
T2
Carrier Strip Thickness
0.014
0.027
0.35
0.65
W
Carrier Strip Width
0.6889
0.7481
17.5
19
W1
Adhesive Tape Width
0.2165
0.2841
5.5
6.3
W2
Adhesive Tape Position
.0059
0.01968
.15
0.5
NOTES:
1. Maximum alignment deviation between leads not to be greater than 0.2 mm.
2. Defective components shall be clipped from the carrier tape such that the remaining protrusion (L) does not exceed a maximum of 11 mm.
3. Component lead to tape adhesion must meet the pull test requirements established in Figures 5, 6 and 7.
4. Maximum non–cumulative variation between tape feed holes shall not exceed 1 mm in 20 pitches.
5. Holddown tape not to extend beyond the edge(s) of carrier tape and there shall be no exposure of adhesive.
6. No more than 1 consecutive missing component is permitted.
7. A tape trailer and leader, having at least three feed holes is required before the first and after the last component.
8. Splices will not interfere with the sprocket feed holes.
相關(guān)PDF資料
PDF描述
MSB1218A-RT3 100 mA, 45 V, PNP, Si, SMALL SIGNAL TRANSISTOR
MSC1210SS 0 TIMER(S), REAL TIME CLOCK, PDIP30
MSC1210GS-K 0 TIMER(S), REAL TIME CLOCK, PDSO32
MSC2295-BT3 UHF BAND, Si, NPN, RF SMALL SIGNAL TRANSISTOR
MSC2295-CT3 UHF BAND, Si, NPN, RF SMALL SIGNAL TRANSISTOR
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MSA-1023 制造商:AGILENT 制造商全稱:AGILENT 功能描述:Cascadable Silicon Bipolar MMIC Amplifier
MSA-1100 制造商:Avago Technologies 功能描述:CASCADABLE SILICON BIPOLAR MMICMUST BE WAFER 6924-111 - Bulk
MSA-1100-GP4 制造商:Avago Technologies 功能描述:AMPLIFIER, SI, RFIC - Bulk
MSA-1104 制造商:AGILENT 制造商全稱:AGILENT 功能描述:Cascadable Silicon Bipolar MMIC Amplifier
MSA-1105 制造商:AGILNT 功能描述: