參數(shù)資料
型號: MRF6V2150NR1
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 功率晶體管
英文描述: UHF BAND, Si, N-CHANNEL, RF POWER, MOSFET, TO-270
封裝: ROHS COMPLIANT, PLASTIC, CASE 1486-03, WB, 4 PIN
文件頁數(shù): 11/18頁
文件大?。?/td> 1492K
代理商: MRF6V2150NR1
2
RF Device Data
Freescale Semiconductor
MRF6V2150NR1 MRF6V2150NBR1
Table 4. Moisture Sensitivity Level
Test Methodology
Rating
Package Peak Temperature
Unit
Per JESD22--A113, IPC/JEDEC J--STD--020
3
260
°C
Table 5. Electrical Characteristics (TA =25°C unless otherwise noted)
Characteristic
Symbol
Min
Typ
Max
Unit
Off Characteristics
Zero Gate Voltage Drain Leakage Current
(VDS = 100 Vdc, VGS =0 Vdc)
IDSS
2.5
mA
Zero Gate Voltage Drain Leakage Current
(VDS =50 Vdc, VGS =0 Vdc)
IDSS
50
μAdc
Drain--Source Breakdown Voltage
(ID =75 mA, VGS =0 Vdc)
V(BR)DSS
110
Vdc
Gate--Source Leakage Current
(VGS =5 Vdc, VDS =0 Vdc)
IGSS
10
μAdc
On Characteristics
Gate Threshold Voltage
(VDS =10 Vdc, ID = 400 μAdc)
VGS(th)
1
1.62
3
Vdc
Gate Quiescent Voltage
(VDD =50 Vdc, ID = 450 mAdc, Measured in Functional Test)
VGS(Q)
1.5
2.6
3.5
Vdc
Drain--Source On--Voltage
(VGS =10 Vdc, ID =1 Adc)
VDS(on)
0.26
Vdc
Dynamic Characteristics
Reverse Transfer Capacitance
(VDS =50 Vdc ± 30 mV(rms)ac @ 1 MHz, VGS =0 Vdc)
Crss
1.6
pF
Output Capacitance
(VDS =50 Vdc ± 30 mV(rms)ac @ 1 MHz, VGS =0 Vdc)
Coss
93
pF
Input Capacitance
(VDS =50 Vdc, VGS =0 Vdc ± 30 mV(rms)ac @ 1 MHz)
Ciss
163
pF
Functional Tests (In Freescale Test Fixture, 50 ohm system) VDD =50 Vdc, IDQ = 450 mA, Pout = 150 W, f = 220 MHz, CW
Power Gain
Gps
23.5
25
26.5
dB
Drain Efficiency
ηD
66
68.3
%
Input Return Loss
IRL
--17
--9
dB
Typical Performances (In Freescale 27 MHz and 450 MHz Test Fixtures, 50 ohm system) VDD =50 Vdc, IDQ = 450 mA, Pout = 150 W CW
Power Gain
f = 27 MHz
f = 450 MHz
Gps
32.3
22.9
dB
Drain Efficiency
f = 27 MHz
f = 450 MHz
ηD
78.7
57.6
%
Input Return Loss
f = 27 MHz
f = 450 MHz
IRL
--10.6
--17.6
dB
ATTENTION: The MRF6V2150N and MRF6V2150NB are high power devices and special considerations
must be followed in board design and mounting. Incorrect mounting can lead to internal temperatures which
exceed the maximum allowable operating junction temperature. Refer to Freescale Application Note AN3263
(for bolt down mounting) or AN1907 (for solder reflow mounting) PRIOR TO STARTING SYSTEM DESIGN to
ensure proper mounting of these devices.
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