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參數(shù)資料
| 型號： | MR82C55A/B |
| 廠商： | INTERSIL CORP |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 24 I/O, PIA-GENERAL PURPOSE, CQCC44 |
| 封裝： | CERAMIC, LCC-44 |
| 文件頁數(shù)： | 18/26頁 |
| 文件大?。?/td> | 581K |
| 代理商： | MR82C55A/B |
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25
82C55A
Ceramic Leadless Chip Carrier Packages (CLCC)
D
j x 45o
D3
B
h x 45o
A
A1
E
L
L3
e
B3
L1
D2
D1
e1
E2
E1
L2
PLANE 2
PLANE 1
E3
B2
0.010
E H
S
0.010
E F
S
-E-
0.007
E F
M
S HS
B1
-H-
-F-
J44.A MIL-STD-1835 CQCC1-N44 (C-5)
44 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.064
0.120
1.63
3.05
6, 7
A1
0.054
0.088
1.37
2.24
-
B
0.033
0.039
0.84
0.99
4
B1
0.022
0.028
0.56
0.71
2, 4
B2
0.072 REF
1.83 REF
-
B3
0.006
0.022
0.15
0.56
-
D
0.640
0.662
16.26
16.81
-
D1
0.500 BSC
12.70 BSC
-
D2
0.250 BSC
6.35 BSC
-
D3
-
0.662
-
16.81
2
E
0.640
0.662
16.26
16.81
-
E1
0.500 BSC
12.70 BSC
-
E2
0.250 BSC
6.35 BSC
-
E3
-
0.662
-
16.81
2
e
0.050 BSC
1.27 BSC
-
e1
0.015
-
0.38
-
2
h
0.040 REF
1.02 REF
5
j
0.020 REF
0.51 REF
5
L
0.045
0.055
1.14
1.40
-
L1
0.045
0.055
1.14
1.40
-
L2
0.075
0.095
1.90
2.41
-
L3
0.003
0.015
0.08
0.38
-
ND
11
3
NE
11
3
N44
44
3
Rev. 0 5/18/94
NOTES:
1. Metallized castellations shall be connected to plane 1 terminals
and extend toward plane 2 across at least two layers of ceramic
or completely across all of the ceramic layers to make electrical
connection with the optional plane 2 terminals.
2. Unless otherwise specified, a minimum clearance of 0.015 inch
(0.38mm) shall be maintained between all metallized features
(e.g., lid, castellations, terminals, thermal pads, etc.)
3. Symbol “N” is the maximum number of terminals. Symbols “ND”
and “NE” are the number of terminals along the sides of length
“D” and “E”, respectively.
4. The required plane 1 terminals and optional plane 2 terminals (if
used) shall be electrically connected.
5. The corner shape (square, notch, radius, etc.) may vary at the
manufacturer’s option, from that shown on the drawing.
6. Chip carriers shall be constructed of a minimum of two ceramic
layers.
7. Dimension “A” controls the overall package thickness. The maxi-
mum “A” dimension is package height before being solder dipped.
8. Dimensioning and tolerancing per ANSI Y14.5M-1982.
9. Controlling dimension: INCH.
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| MR82C59A/B | 80C86; 80C88; 80C286; 8080; 8085; 8086; 8088; 80286; NSC800 COMPATIBLE, INTERRUPT CONTROLLER, CQCC28 |
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| MD82C59A-5/B | 80C86; 80C88; 80C286; 8080; 8085; 8086; 8088; 80286; NSC800 COMPATIBLE, INTERRUPT CONTROLLER, CDIP28 |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MR82C55B | 制造商:HARRIS 制造商全稱:HARRIS 功能描述:CMOS Programmable Peripheral Interface |
| MR82C59A | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:CMOS Priority Interrupt Controller |
| MR82C59A-12 | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:CMOS Priority Interrupt Controller |
| MR82C59A-12/B | 制造商:Rochester Electronics LLC 功能描述:- Bulk 制造商:Harris Corporation 功能描述: |
| MR82C59A-12B | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:CMOS Priority Interrupt Controller |
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