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    參數(shù)資料
    型號: MQSMBJ75CAE3TR
    廠商: MICROSEMI CORP-SCOTTSDALE
    元件分類: TVS二極管 - 瞬態(tài)電壓抑制
    英文描述: 600 W, BIDIRECTIONAL, SILICON, TVS DIODE, DO-214AA
    封裝: ROHS COMPLIANT, PLASTIC PACKAGE-2
    文件頁數(shù): 1/4頁
    文件大?。?/td> 182K
    代理商: MQSMBJ75CAE3TR
    SURFACE MOUNT 600 Watt
    Transient Voltage Suppressor
    WWW
    .Microse
    m
    i
    .CO
    M
    S C O T TS DALE DIVISION
    SMBJ5.0 thru SMBJ170A, CA, e3
    and SMBG5.0 thru SMBG170A, CA, e3
    SMB5.0–
    170AC,
    e3
    DESCRIPTION
    APPEARANCE
    This SMBJ5.0-170A or SMBG5.0-170A series of surface mount 600 W
    Transient Voltage Suppressors (TVSs) protects a variety of voltage-sensitive
    components from destruction or degradation. It is available in J-bend design
    (SMBJ) with the DO-214AA package for greater PC board mounting density or
    in a Gull-wing design (SMBG) in the DO-215AA for visible solder connections.
    It is also available in both unidirectional and bidirectional configurations with a
    C or CA suffix part number as well as RoHS Compliant with an e3 suffix. Their
    response time is virtually instantaneous. As a result, they can be used for
    protection from ESD or EFT per IEC61000-4-2 and IEC61000-4-4, or for
    inductive switching environments and induced RF protection. They can also
    protect from secondary lightning effects per IEC61000-4-5 and class levels
    defined herein. Microsemi also offers numerous other TVS products to meet
    higher and lower power demands and special applications.
    NOTE: All SMB series are
    equivalent to prior SMS package
    identifications.
    IMPORTANT:
    For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
    FEATURES
    APPLICATIONS / BENEFITS
    Available in both unidirectional and bidirectional
    construction (add C or CA suffix for bidirectional)
    Selections for 5.0 to 170 volts standoff voltages (VWM)
    Optional 100% screening for avionics grade is available
    by adding MA prefix to part number for 100% temperature
    cycle -55
    oC to +125oC (10X) as well as surge (3X) and 24
    hours HTRB with post test VZ & IR (in operating direction
    for unidirectional or both directions for bidirectional)
    Options for screening in accordance with MIL-PRF-19500
    for JAN, JANTX, and JANTXV by adding MQ, MX, or MV
    prefixes respectively to part numbers.
    Axial-lead equivalent packages for thru-hole mounting
    available as P6KE6.8 to P6KE200CA (consult factory for
    other surface mount options)
    Moisture classification is Level 1 with no dry pack required
    per IPC/JEDEC J-STD-020B
    RoHS compliant devices available by adding an “e3” suffix
    Economical surface mount design in both J-bend or
    Gull-wing terminations
    Protects sensitive components such as IC’s, CMOS,
    Bipolar, BiCMOS, ECL, DTL, T
    2L, etc.
    Protection from switching transients & induced RF
    Compliant to IEC61000-4-2 and IEC61000-4-4 for
    ESD and EFT protection respectively
    Secondary lightning protection per IEC61000-4-5 with
    42 Ohms source impedance:
    Class 1: SMB 5.0 to SMB 120A or CA
    Class 2: SMB 5.0 to SMB 60A or CA
    Class 3: SMB 5.0 to SMB 30A or CA
    Class 4: SMB 5.0 to SMB 15A or CA
    Secondary lightning protection per IEC61000-4-5 with
    12 Ohms source impedance:
    Class 1: SMB 5.0 to SMB 36A or CA
    Class 2: SMB 5.0 to SMB 18A or CA
    MAXIMUM RATINGS
    MECHANICAL AND PACKAGING
    Peak Pulse Power dissipation at 25C: 600 watts at
    10/1000 μs (also see Fig 1,2, and 3).
    Impulse repetition rate (duty factor): 0.01%
    tclamping (0 volts to V(BR) min.): < 100 ps theoretical for
    unidirectional and < 5 ns for bidirectional
    Operating and Storage temperature: -65C to +150C
    Thermal resistance: 25 C/W junction to lead, or 90C/W
    junction to ambient when mounted on FR4 PC board (1oz
    Cu) with recommended footprint (see last page)
    Steady-State Power dissipation: 5 watts at TL = 25oC, or
    1.38 watts at TA = 25
    C when mounted on FR4 PC board
    with recommended footprint
    Forward Surge at 25C: 100 Amps peak impulse of 8.3
    ms half-sine wave (unidirectional only)
    Solder temperatures: 260 C for 10 s (maximum)
    CASE: Void-free transfer molded thermosetting
    epoxy body meeting UL94V-0
    TERMINALS: Gull-wing or C-bend (modified J-bend)
    tin-lead or RoHS compliant annealed matte-tin plating
    solderable per MIL-STD-750, method 2026
    POLARITY: Cathode indicated by band. No marking
    on bi-directional devices
    MARKING: Part number without standard prefix (e.g.
    5.0, 5.0A, 5.0CA, 5.0Ae3, 36, MX36A, 36CAe3, etc.)
    TAPE & REEL option: Standard per EIA-481-1-A with
    12 mm tape, 750 per 7 inch reel or 2500 per 13 inch
    reel (add “TR” suffix to part number)
    WEIGHT: 0.1 grams
    See package dimension on last page
    Microsemi
    Scottsdale Division
    Page 1
    Copyright
    2007
    6-20-2007 REV H
    8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
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