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參數(shù)資料
| 型號： | MPZ2012S101A |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | 2.7-W CONSTANT OUTPUT POWER CLASS-D AUDIO AMPLIFIER WITH INTEGRATED BOOST CONVERTER |
| 中文描述： | 2.7鎢恒定輸出功率D類音頻放大器，具有集成升壓轉(zhuǎn)換器 |
| 文件頁數(shù)： | 14/28頁 |
| 文件大?。?/td> | 753K |
| 代理商： | MPZ2012S101A |
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www.ti.com
A
J
JA Dmax
T Max = T Max
P
= 150
80.64 (0.317) = 124 C
- q
-
°
(9)
BOARD LAYOUT
Copper TraceWidth
Solder PadWidth
SolderMask Opening
Copper Trace Thickness
SolderMask Thickness
TPA2013D1
SLOS520 – AUGUST 2007
Equation 9 shows that the calculated maximum ambient temperature is 124
°C at maximum power dissipation
under the above conditions. The TPA2013D1 is designed with thermal protection that turns the device off when
the junction temperature surpasses 150
°C to prevent damage to the IC. Also, using speakers more resistive than
4-
dramatically increases the thermal performance by reducing the output current and increasing the efficiency
of the amplifier.
In making the pad size for the WCSP balls, use nonsolder mask defined (NSMD) land. With this method, the
solder mask opening is made larger than the desired land area, and the opening size is defined by the copper
pad width. Figure 35 and Table 5 show the appropriate diameters for a WCSP layout.
Figure 35. Land Pattern Dimensions
Table 5. Land Pattern Dimensions
SOLDER PAD
SOLDER MASK
COPPER
STENCIL
COPPER PAD
DEFINITIONS
OPENING
THICKNESS
OPENING
THICKNESS
Nonsolder mask
275
μm
375
μm
1 oz max (32
μm)
275
μm x 275 μm Sq.
125
μm thick
defined (NSMD)
(+0.0, –25
μm)
(+0.0, –25
μm)
(rounded corners)
NOTES:
1. Circuit traces from NSMD defined PWB lands should be 75
μm to 100 μm wide in the exposed area inside
the solder mask opening. Wider trace widths reduce device stand off and impact reliability.
2. Recommend solder paste is Type 3 or Type 4.
3. Best reliability results are achieved when the PWB laminate glass transition temperature is above the
operating the range of the intended application.
4. For a PWB using a Ni/Au surface finish, the gold thickness should be less 0.5 mm to avoid a reduction in
thermal fatigue performance.
5. Solder mask thickness should be less than 20
μm on top of the copper circuit pattern.
6. Best solder stencil performance is achieved using laser cut stencils with electro polishing. Use of chemically
etched stencils results in inferior solder paste volume control.
7. Trace routing away from WCSP device should be balanced in X and Y directions to avoid unintentional
component movement due to solder wetting forces.
Copyright 2007, Texas Instruments Incorporated
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參數(shù)描述 |
|---|---|
| MPZ2012S101AT | 制造商:TDK Innoveta 功能描述:Ferrite Beads Multi-Layer Chip Bead 100Ohm 25% 100MHz 4A 0805 T/R |
| MPZ2012S101AT000 | 制造商:TDK 功能描述: |
| MPZ2012S101ATD25 | 制造商:TDK 功能描述:FERRITE CHIP BEADS - Tape and Reel |
| MPZ2012S102A | 功能描述:電磁干擾濾波珠子、扼流圈和陣列 0805 1000ohms 100MHz Rdc 0.15ohms 1.5A RoHS:否 制造商:AVX 阻抗: 最大直流電流:35 mA 最大直流電阻: 容差: 端接類型:SMD/SMT 電壓額定值:25 V 工作溫度范圍:- 25 C to + 85 C 封裝 / 箱體:0603 (1608 metric) |
| MPZ2012S102AT | 制造商:TDK 功能描述:Ferrite Beads Multi-Layer Chip Bead 1KOhm 25% 100MHz 1.5A 0805 制造商:TDK 功能描述:MPZ Series 1 kO 25 % 100 MHz 1.5 A 0805 Multi-Layer Chip Ferrite Bead 制造商:TDK 功能描述:MPZ Series 1 kO ?25 % 100 MHz 1.5 A 0805 Multi-Layer Chip Ferrite Bead |
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