參數(shù)資料
型號(hào)： MPXV5010D
廠商： 飛思卡爾半導(dǎo)體(中國(guó))有限公司
英文描述： Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
中文描述： 集成硅壓力傳感器的片上信號(hào)空調(diào)，溫度補(bǔ)償和校準(zhǔn)
文件頁(yè)數(shù)： 4/18頁(yè)
文件大小： 449K
代理商： MPXV5010D
MPX5010
Sensors
4
Freescale Semiconductor
ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING
The performance over temperature is achieved by
integrating the shear-stress strain gauge, temperature
compensation, calibration and signal conditioning circuitry
onto a single monolithic chip.
Figure 2
illustrates the Differential or Gauge configuration
in the basic chip carrier (Case 482). A fluorosilicone gel
isolates the die surface and wire bonds from the environment,
while allowing the pressure signal to be transmitted to the
sensor diaphragm.
The MPX5010 and MPXV5010G series pressure sensor
operating characteristics, and internal reliability and
qualification tests are based on use of dry air as the pressure
media. Media, other than dry air, may have adverse effects on
sensor performance and long-term reliability. Contact the
factory for information regarding media compatibility in your
application.
Figure 3
shows the recommended decoupling circuit for
interfacing the integrated sensor to the A/D input of a
microprocessor or microcontroller. Proper decoupling of the
power supply is recommended.
Figure 4
shows the sensor output signal relative to
pressure input. Typical, minimum, and maximum output
curves are shown for operation over a temperature range of
0
°
to 85
°
C using the decoupling circuit shown in
Figure 3
. The
output will saturate outside of the specified pressure range.
Figure 2. Cross-Sectional Diagram SOP
(not to scale)
Figure 3. Recommended Power Supply Decoupling
and Output Filtering
(For additional output filtering, please refer to
Application Note AN1646.)
Figure 4. Output versus Pressure Differential
Fluoro Silicone
Gel Die Coat
Wire Bond
Die
P1
Stainless
Steel Cap
Thermoplastic
Case
Die Bond
Differential Sensing
Element
P2
+5 V
1.0
μ
F
0.01
μ
F
470 pF
GND
V
s
V
out
IPS
OUTPUT
Lead
Frame
Differential Pressure (kPa)
O
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
00
1
2
3
4
5
6
7
8
9
11
10
TYPICAL
MIN
MAX
Transfer Function:
V
out
= V
S
*(0.09*P+0.04) ± ERROR
V
S
= 5.0 Vdc
TEMP = 0 to 85°C
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPXV5010DP 功能描述:板上安裝壓力/力傳感器 SOP DUAL PORT RoHS:否 制造商:Honeywell 工作壓力:0 bar to 4 bar 壓力類(lèi)型:Gage 準(zhǔn)確性:+ / - 0.25 % 輸出類(lèi)型:Digital 安裝風(fēng)格:Through Hole 工作電源電壓:5 V 封裝 / 箱體:SIP 端口類(lèi)型:Dual Radial Barbed, Same sides
MPXV5010DP 制造商:Freescale Semiconductor 功能描述:IC PRESSURE SENSOR ((NW))
MPXV5010G 制造商:FREESCALE 制造商全稱(chēng):Freescale Semiconductor, Inc 功能描述:Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
MPXV5010G6U 功能描述:板上安裝壓力/力傳感器 MPXV5010G6U RoHS:否 制造商:Honeywell 工作壓力:0 bar to 4 bar 壓力類(lèi)型:Gage 準(zhǔn)確性:+ / - 0.25 % 輸出類(lèi)型:Digital 安裝風(fēng)格:Through Hole 工作電源電壓:5 V 封裝 / 箱體:SIP 端口類(lèi)型:Dual Radial Barbed, Same sides
MPXV5010G7U 制造商:MOTOROLA 制造商全稱(chēng):Motorola, Inc 功能描述:Sensor
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