參數(shù)資料
型號(hào): MPXV5004G
廠商: Motorola, Inc.
英文描述: Pressure Sensor(壓力傳感器)
中文描述: 壓力傳感器(壓力傳感器)
文件頁(yè)數(shù): 3/8頁(yè)
文件大?。?/td> 154K
代理商: MPXV5004G
3
Motorola Sensor Device Data
ON–CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING
The performance over temperature is achieved by inte-
grating the shear–stress strain gauge, temperature com-
pensation, calibration and signal conditioning circuitry onto a
single monolithic chip.
Figure 2 illustrates the gauge configuration in the basic chip
carrier (Case 473). A fluorosilicone gel isolates the die surface
and wire bonds from the environment, while allowing the pres-
sure signal to be transmitted to the silicon diaphragm.
The MPXV5004G series sensor operating characteristics
are based on use of dry air as pressure media. Media, other
than dry air, may have adverse effects on sensor performance
and long–term reliability. Internal reliability and qualification
test for dry air, and other media, are available from the factory.
Contact the factory for information regarding media tolerance
in your application.
Figure 3 shows a typical decoupling circuit for interfacing
the output of the MPXV5004G to the A/D microprocessor.
Proper decoupling of the power supply is recommended.
Figure 4 shows the sensor output signal relative to pres-
sure input. Typical, minimum and maximum output curves
are shown for operation over 10
°
C to 60
°
C. (Device output
may be nonlinear outside of the rated pressure range.)
Figure 2. Cross–Sectional Diagram (Not to Scale)
Figure 3. Recommended power supply decoupling
and output filtering.
Please refer to Application Note AN1646.
Figure 4. Output versus Pressure Differential
MAX
DIFFERENTIAL PRESSURE
5.0
4.0
3.0
2.0
O
TRANSFER FUNCTION:
Vout = VS*(0.2*P) + 0.2]
±
1.5% VFSS
VS = 5.0 V
±
0.25 Vdc
TEMP = 10 to 60
°
C
1.0
MIN
TYPICAL
FLUOROSILICONE
DIE COAT
WIRE BONDS
EXTERNAL LEAD
CONNECTIONS
DIFFERENTIAL DIE
STAINLESS STEEL
METAL COVER
PPS CASE
P1
P2
RTV DIE BOND
2 kPa
200 mmH2O
(See Note 5 in Operating Characteristics)
4 kPa
400 mmH2O
1.0 F
IPS
0.33 F
A/D
3
5 V
0.01 F
750
2
1
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPXV5004G_07 制造商:FREESCALE 制造商全稱(chēng):Freescale Semiconductor, Inc 功能描述:Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
MPXV5004G6T1 制造商:FREESCALE 制造商全稱(chēng):Freescale Semiconductor, Inc 功能描述:Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
MPXV5004G6U 功能描述:板上安裝壓力/力傳感器 INTEGRATED PRESSURE SENSR RoHS:否 制造商:Honeywell 工作壓力:0 bar to 4 bar 壓力類(lèi)型:Gage 準(zhǔn)確性:+ / - 0.25 % 輸出類(lèi)型:Digital 安裝風(fēng)格:Through Hole 工作電源電壓:5 V 封裝 / 箱體:SIP 端口類(lèi)型:Dual Radial Barbed, Same sides
MPXV5004G7U 功能描述:板上安裝壓力/力傳感器 IPS SOP RoHS:否 制造商:Honeywell 工作壓力:0 bar to 4 bar 壓力類(lèi)型:Gage 準(zhǔn)確性:+ / - 0.25 % 輸出類(lèi)型:Digital 安裝風(fēng)格:Through Hole 工作電源電壓:5 V 封裝 / 箱體:SIP 端口類(lèi)型:Dual Radial Barbed, Same sides
MPXV5004G7U 制造商:Freescale Semiconductor 功能描述:Special Function IC Package/Case:CASE 48