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參數(shù)資料
| 型號(hào)： | MPXV5004G6U |
| 廠商： | 飛思卡爾半導(dǎo)體(中國(guó))有限公司 |
| 元件分類： | 壓力傳感器 |
| 英文描述： | Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated |
| 中文描述： | 集成硅壓力傳感器的片上信號(hào)空調(diào)，溫度補(bǔ)償和校準(zhǔn) |
| 文件頁(yè)數(shù)： | 4/12頁(yè) |
| 文件大小： | 267K |
| 代理商： | MPXV5004G6U |
4
Sensor Device Data
Freescale Semiconductor
MPXV5004G SERIES
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale Semiconductor designates the two sides of the
pressure sensor as the Pressure (P1) side and the Vacuum
(P2) side. The Pressure (P1) side is the side containing sili-
cone gel which isolates the die from the environment. The
Freescale Semiconductor pressure sensor isdesigned toop-
erate with positive differential pressure applied, P1 > P2.
The Pressure (P1) sidemay beidentified byusing thetable
below:
Part Number
Case Type
Pressure (P1) Side Identifier
MPXV5004GC6U/T1
482A
Side with Port Attached
MPXV5004G6U/T1
482
Stainless Steel Cap
MPXV5004GC7U
482C
Side with Port Attached
MPXV5004G7U
482B
Stainless Steel Cap
MPXV5004GP
1369
Side with Port Attached
MPXV5004DP
1351
Side with Port Marking
MPXV5004GVP
1368
Stainless Steel Cap
ORDERING INFORMATION
MPXV5004G series pressure sensors are available in the basic element package or with a pressure port. Two packing
options are offered for the surface mount configuration.
Device Type / Order No.
MPXV5004G6U
MPXV5004G6T1
MPXV5004GC6U
MPXV5004GC6T1
MPXV5004GC7U
MPXV5004G7U
MPXV5004GP
MPXV5004DP
MPXV5004GVP
Case No.
482
482
482A
482A
482C
482B
1369
1351
1368
Packing Options
Device Marking
MPXV5004G
MPXV5004G
MPXV5004G
MPXV5004G
MPXV5004G
MPXV5004G
MPXV5004G
MPXV5004G
MPXV5004G
Rails
Tape and Reel
Rails
Tape and Reel
Rails
Rails
Trays
Trays
Trays
INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482)
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must
be the correct size to ensure proper solder connection inter-
face between the board and the package. With the correct
fottprint, the packages will self align when subjected to a
solder reflow process. It is always recommended to design
boards with a solder mask layer to avoid bridging and short-
ing between solder pads.
0.660
16.76
0.060 TYP 8X
1.52
0.100 TYP 8X
2.54
0.100 TYP 8X
2.54
0.300
7.62
Figure 5. SOP Footprint (Case 482)
inch
mm
SCALE 2:1
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| MPXV5004G7U | Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated |
| MPXV5004GC6T1 | Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated |
| MPXV5004GC6U | Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated |
| MPXV5004GC7U | Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated |
| MPXV5004GP | Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MPXV5004G7U | 功能描述:板上安裝壓力/力傳感器 IPS SOP RoHS:否 制造商:Honeywell 工作壓力:0 bar to 4 bar 壓力類型:Gage 準(zhǔn)確性:+ / - 0.25 % 輸出類型:Digital 安裝風(fēng)格:Through Hole 工作電源電壓:5 V 封裝 / 箱體:SIP 端口類型:Dual Radial Barbed, Same sides |
| MPXV5004G7U | 制造商:Freescale Semiconductor 功能描述:Special Function IC Package/Case:CASE 48 |
| MPXV5004GC6T1 | 功能描述:板上安裝壓力/力傳感器 IPS SOP RoHS:否 制造商:Honeywell 工作壓力:0 bar to 4 bar 壓力類型:Gage 準(zhǔn)確性:+ / - 0.25 % 輸出類型:Digital 安裝風(fēng)格:Through Hole 工作電源電壓:5 V 封裝 / 箱體:SIP 端口類型:Dual Radial Barbed, Same sides |
| MPXV5004GC6U | 功能描述:板上安裝壓力/力傳感器 INTEGRATED PRESSURE SENSR RoHS:否 制造商:Honeywell 工作壓力:0 bar to 4 bar 壓力類型:Gage 準(zhǔn)確性:+ / - 0.25 % 輸出類型:Digital 安裝風(fēng)格:Through Hole 工作電源電壓:5 V 封裝 / 箱體:SIP 端口類型:Dual Radial Barbed, Same sides |
| MPXV5004GC6U | 制造商:Freescale Semiconductor 功能描述:Pressure Sensor IC |
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