參數(shù)資料
    型號(hào): MPXC2011DT1
    廠商: MOTOROLA INC
    元件分類: 壓力傳感器
    英文描述: Pressure Sensor(壓力傳感器)
    中文描述: DIFFERENTIAL, PEIZORESISTIVE PRESSURE SENSOR, 0-1.45Psi, 1%, 0-25mV, RECTANGULAR, THROUGH HOLE MOUNT
    封裝: DIE-4
    文件頁(yè)數(shù): 1/4頁(yè)
    文件大?。?/td> 83K
    代理商: MPXC2011DT1
    1
    Motorola, Inc. 1999
    "
    # " !
    Motorola has developed a low cost, high volume, miniature pressure sensor package
    which is ideal as a sub–module component or a disposable unit. The unique concept of
    the Chip Pak allows great flexibility in system design while allowing an economic solution
    for the designer. This new chip carrier package uses Motorola’s unique sensor die with its
    piezoresistive technology, along with the added feature of on–chip, thin–film temperature
    compensation and calibration.
    Features:
    Low Cost
    Patented piezoresistive strain gauge implant, temperature compensation and
    calibration all integrated on a single, monolithic sensor die.
    Pressure Range Available: 0–10 kPa
    Polysulfone (Mindel S–1000) Case Material (Medical, Class VI Approved)
    Application Examples
    Respiratory Diagnostics
    Air Movement Control
    Controllers
    Pressure Switching
    Motorola is offering the Chip Pak option package. Application–specific parts will have
    an “SPX” prefix, followed by a four digit number, unique to the specific customer. Devices
    will be shipped in a tape and reel packaging.
    NOTE:
    The die and wire bonds are exposed on the front side of the Chip Pak. Front
    side die and wire protection must be provided in the customer’s housing. Use caution
    when handling the devices during all processes. P1 is defined as the pressure applies to
    front side (wirebond side) of the Chip Pak and P2 is defined as the pressure applied to
    the backside (portal side).
    Motorola’s MPXC2011DT1 Pressure Sensors.
    Motoro-
    la’s MPXC2011DT1 pressure sensor has been designed for
    medical usage by combining the performance of Motorola’s
    shear stress pressure sensor design and the use of
    biomedically approved materials. Materials with a proven
    history in medical situations have been chosen to provide a
    sensor that can be used with confidence in applications,
    such as invasive blood pressure monitoring. It can be
    sterilized using ethylene oxide. The portions of the pressure
    sensor that are required to be biomedically approved are the
    rigid housing and the gel coating.
    The rigid housing is molded from a white, medical grade
    polysulfone that has passed extensive biological testing
    including: tissue culture test, rabbit implant, hemolysis,
    intracutaneous test in rabbits, and system toxicity, USP.
    A silicone dielectric gel that has been used extensively in
    implants covers the silicon piezoresistive sensing element.
    The gel is a nontoxic, nonallergenic polymer system which
    passes pyrogen testing, as well as meeting all USP XX Bio-
    logical Testing Class VI requirements. The properties of the
    gel allow it to transmit pressure uniformly to the diaphragm
    surface, while isolating the internal electrical connections
    from the corrosive effects of fluids, such as saline solution.
    The gel provides electrical isolation sufficient to withstand
    defibrillation testing, as specified in the proposed Association
    for the Advancement of Medical Instrumentation (AAMI)
    Standard for blood pressure transducers. A biomedically ap-
    proved opaque filler in the gel prevents bright operating room
    lights from affecting the performance of the sensor.
    X–ducer is a trademark of Motorola, Inc.
    Order this document
    by MPXC2011DT1/D
    SEMICONDUCTOR TECHNICAL DATA
    PRESSURE SENSORS
    PIN NUMBER
    CHIP PAK ELEMENT
    CASE 423A–03
    1
    2
    Gnd
    S+
    3
    4
    VS
    S–
    REV 0
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