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參數(shù)資料
| 型號(hào)： | MPXAZ6115A |
| 廠商： | 飛思卡爾半導(dǎo)體(中國(guó))有限公司 |
| 英文描述： | Media Resistant and High Temperature Accuracy Integrated Silicon Pressure Sensor for Measuring Absolute Pressure, On-Chip Signal Conditioned, Temperature Compensated and Calibrated(中間電阻，高溫度精度集成硅壓力傳感器，用于測(cè)量絕對(duì)壓力，具有片內(nèi)信號(hào)調(diào)節(jié)、溫度補(bǔ)償和校準(zhǔn)功能) |
| 中文描述： | 媒體，抗高溫高精度集成硅壓力傳感器測(cè)量絕對(duì)壓力，片上信號(hào)空調(diào)，溫度補(bǔ)償和校準(zhǔn)（中間電阻，高溫度精度集成硅壓力傳感器，用于測(cè)量絕對(duì)壓力，具有片內(nèi)信號(hào)調(diào)節(jié)，溫度補(bǔ)償和校準(zhǔn)功能） |
| 文件頁(yè)數(shù)： | 5/12頁(yè) |
| 文件大小： | 251K |
| 代理商： | MPXAZ6115A |
MPXAZ6115A MPXHZ6115A SERIES
Motorola Sensor Device Data
MPXAZ6115A
5
SURFACE MOUNTING INFORMATION
MINIMUM RECOMMENDED FOOTPRINT FOR SMALL OUTLINE PACKAGE
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor package must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct pad
geometry, the packages will self-align when subjected to
a solder reflow process. It is always recommended to fabricate
boards with a solder mask layer to avoid bridging and/or
shorting between solder pads, especially on tight tolerances
and/or tight layouts.
Figure 5. SOP Footprint (Case 482 and 482A)
MINIMUM RECOMMENDED FOOTPRINT FOR SUPER SMALL OUTLINE PACKAGES
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor package must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct pad
geometry, the packages will self-align when subjected to
a solder reflow process. It is always recommended to fabricate
boards with a solder mask layer to avoid bridging and/or
shorting between solder pads, especially on tight tolerances
and/or tight layouts.
Figure 6. SSOP Footprint (Case 1317 and 1317A)
0.660
16.76
0.060 TYP 8X
1.52
0.100 TYP 8X
2.54
0.100 TYP
2.54
0.300
7.62
inch
mm
0.027 TYP 8X
0.69
0.053 TYP 8X
1.35
inch
mm
0.387
9.83
0.150
3.81
0.050
1.27
TYP
F
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
n
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MPXAZ6115A6T1 | 制造商:FREESCALE 制造商全稱(chēng):Freescale Semiconductor, Inc 功能描述:Media Resistant and High Temperature Accuracy Integrated Silicon Pressure Sensor |
| MPXAZ6115A6U | 功能描述:板上安裝壓力/力傳感器 SOP W/SIFEL 827 GEL RoHS:否 制造商:Honeywell 工作壓力:0 bar to 4 bar 壓力類(lèi)型:Gage 準(zhǔn)確性:+ / - 0.25 % 輸出類(lèi)型:Digital 安裝風(fēng)格:Through Hole 工作電源電壓:5 V 封裝 / 箱體:SIP 端口類(lèi)型:Dual Radial Barbed, Same sides |
| MPXAZ6115A7U | 功能描述:板上安裝壓力/力傳感器 SOP DIP NON- VENTED RoHS:否 制造商:Honeywell 工作壓力:0 bar to 4 bar 壓力類(lèi)型:Gage 準(zhǔn)確性:+ / - 0.25 % 輸出類(lèi)型:Digital 安裝風(fēng)格:Through Hole 工作電源電壓:5 V 封裝 / 箱體:SIP 端口類(lèi)型:Dual Radial Barbed, Same sides |
| MPXAZ6115AC6T1 | 功能描述:板上安裝壓力/力傳感器 16.7psi 115kPA Pressure Sensor RoHS:否 制造商:Honeywell 工作壓力:0 bar to 4 bar 壓力類(lèi)型:Gage 準(zhǔn)確性:+ / - 0.25 % 輸出類(lèi)型:Digital 安裝風(fēng)格:Through Hole 工作電源電壓:5 V 封裝 / 箱體:SIP 端口類(lèi)型:Dual Radial Barbed, Same sides |
| MPXAZ6115AC6U | 功能描述:板上安裝壓力/力傳感器 SOP W/SIFEL 827 GEL RoHS:否 制造商:Honeywell 工作壓力:0 bar to 4 bar 壓力類(lèi)型:Gage 準(zhǔn)確性:+ / - 0.25 % 輸出類(lèi)型:Digital 安裝風(fēng)格:Through Hole 工作電源電壓:5 V 封裝 / 箱體:SIP 端口類(lèi)型:Dual Radial Barbed, Same sides |
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