參數(shù)資料
型號: MPX5999D
廠商: MOTOROLA INC
元件分類: 壓力傳感器
英文描述: Pressure Sensor(壓力傳感器)
中文描述: DIFFERENTIAL, PEIZORESISTIVE PRESSURE SENSOR, 0-145.03Psi, 2.5%, 0.20-4.70V, ROUND, THROUGH HOLE MOUNT
封裝: PLASTIC, UNIBODY PACKAGE-6
文件頁數(shù): 3/8頁
文件大?。?/td> 106K
代理商: MPX5999D
3
Motorola Sensor Device Data
ON–CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING
Figure 2 shows the sensor output signal relative to pres-
sure input. Typical, minimum and maximum output curves
are shown for operation over 0
°
C to 85
°
C
.
(Device output
may be nonlinear outside of the rated pressure range.)
The performance over temperature is achieved by integrat-
ing the shear–stress strain gauge, temperature compensa-
tion, calibration and signal conditioning circuitry onto a single
monolithic chip.
Figure 3 illustrates the differential or gauge configuration in the
basic chip carrier (Case 867). A fluoro silicone gel isolates the die
surface and wire bonds from harsh environments, while allowing
the pressure signal to be transmitted to the silicon diaphragm.
The MPX5999D pressure sensor operating characteristics,
and internal reliability and qualification tests are based on use
of dry air as the pressure media. Media other than dry air may
have adverse effects on sensor performance and long–term
reliability. Contact the factory for information regarding media
compatibility in your application.
MAX
Figure 2. Output versus Pressure Differential
DIFFERENTIAL PRESSURE (kPa)
5.0
4.0
3.0
2.0
0
1100
700
300
0
O
900
500
4.5
3.5
2.5
1.5
100
TRANSFER FUNCTION:
Vout = VS*0.000901*P+0.04)
±
ERROR
VS = 5.0 Vdc
TEMP = 0 to 85
°
C
1.0
0.5
1000
600
200
800
400
MIN
TYPICAL
éééééééééééé
éééééééééééé
éééééééééééé
éééééééééééé
FRAME
SILICONE
DIE COAT
LEAD
STAINLESS STEEL
METAL COVER
BOND
DIE
WIRE BOND
Figure 3. Cross–Sectional Diagram
(Not to Scale)
THERMOPLASTIC CASE
Figure 4. Recommended power supply decoupling
and output filtering.
Please refer to Application Note AN1646.
1.0 F
IPS
0.33 F
A/D
3
5 V
0.01 F
750
2
1
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