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參數(shù)資料
| 型號(hào)： | MPX2300DT1 |
| 廠商： | 飛思卡爾半導(dǎo)體(中國(guó))有限公司 |
| 英文描述： | High Volume Pressure Sensor For Disposable Applications(用于一次性應(yīng)用的高容量壓力傳感器) |
| 中文描述： | 一次性大批量應(yīng)用壓力傳感器（用于一次性應(yīng)用的高容量壓力傳感器） |
| 文件頁(yè)數(shù)： | 1/4頁(yè) |
| 文件大?。?/td> | 98K |
| 代理商： | MPX2300DT1 |
MPX2300DT1 MPX2301DT1
1
Sensor Device Data
Freescale Semiconductor
High Volume Pressure Sensor
For Disposable Applications
Freescale Semiconductor has developed a low cost, high volume, miniature pressure
sensor package which is ideal as a sub--module component or a disposable unit. The
unique concept of the Chip Pak allows great flexibility in system design while allowing an
economic solution for the designer. This new chip carrier package uses Freescale
Semiconductor’s unique sensor die with its piezoresistive technology, along with the
added feature of on--chip, thin--film temperature compensation and calibration.
NOTE:
Freescale Semiconductor is also offering the Chip Pak package in
application--specific configurations, which will have an “SPX” prefix, followed by a
four--digit number, unique to the specific customer.
Features
Low Cost
Integrated Temperature Compensation and Calibration
Ratiometric to Supply Voltage
Polysulfone Case Material (Medical, Class V Approved)
Provided in Easy--to--Use Tape and Reel
Application Examples
Medical Diagnostics
Infusion Pumps
Blood Pressure Monitors
Pressure Catheter Applications
Patient Monitoring
NOTE:
(pressure is applied to the backside of the device). Front side die and wire protection
must be provided in the customer’s housing. Use caution when handling the devices
during all processes.
The die and wire bonds are exposed on the front side of the Chip Pak
Freescale
MPX2301DT1 Pressure Sensors
have been designed for
medical usage by combining the performance of Freescale
Semiconductor’s shear stress pressure sensor design and
the use of biomedically approved materials. Materials with a
proven history in medical situations have been chosen to
provide a sensor that can be used with confidence in
applications, such as invasive blood pressure monitoring. It
can be sterilized using ethylene oxide. The portions of the
pressure sensor that are required to be biomedically
approved are the rigid housing and the gel coating.
The rigid housing is molded from a white, medical grade
polysulfone that has passed extensive biological testing
including: tissue culture test, rabbit implant, hemolysis,
intracutaneous test in rabbits, and system toxicity, USP.
Semiconductor’s
MPX2300DT1/
A silicone dielectric gel covers the silicon piezoresistive
sensing element. The gel is a nontoxic, nonallergenic elasto-
mer system which meets all USP XX Biological Testing Class
V requirements. The properties of the gel allow it to transmit
pressure uniformly to the diaphragm surface, while isolating
the internal electrical connections from the corrosive effects
of fluids, such as saline solution. The gel provides electrical
isolation sufficient to withstand defibrillation testing, as speci-
fied in the proposed Association for the Advancement of
Medical Instrumentation (AAMI) Standard for blood pressure
transducers. Abiomedically approved opaque filler in the gel
prevents bright operating room lights from affecting the per-
formance of the sensor. The
MPX2301DT1
is a reduced gel
option.
Preferred
devices are Freescale Semiconductor recommended choices for future use and best overall value.
MPX2300DT1
Rev. 6, 10/2004
Freescale Semiconductor
Technical Data
Freescale Semiconductor, Inc., 2004. All rights reserved.
MPX2300DT1
MPX2301DT1
PRESSURE SENSORS
0 to 300 mmHg (0 to 40 kPa)
PIN NUMBER
V
S
S+
MPX2300/1DT1
CASE 423A
1
2
3
4
S--
Gnd
Freescale Semiconductor Preferred Device
CHIP PAK PACKAGE
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| MPX5100D | Integrated Silicon Pressure Sensor, On-Chip Signal Conditioned, Temperature Compensated and Calibrated(集成硅壓力傳感器，具有片內(nèi)信號(hào)調(diào)節(jié)、溫度補(bǔ)償和校準(zhǔn)功能) |
| MPX5100DP | Integrated Silicon Pressure Sensor, On-Chip Signal Conditioned, Temperature Compensated and Calibrated(集成硅壓力傳感器，具有片內(nèi)信號(hào)調(diào)節(jié)、溫度補(bǔ)償和校準(zhǔn)功能) |
| MPX5700D | Integrated Silicon Pressure Sensor, On-Chip Signal Conditioned, Temperature Compensated and Calibrated(集成硅壓力傳感器，具有片內(nèi)信號(hào)調(diào)節(jié)、溫度補(bǔ)償和校準(zhǔn)功能) |
| MPX5700DP | Integrated Silicon Pressure Sensor, On-Chip Signal Conditioned, Temperature Compensated and Calibrated(集成硅壓力傳感器，具有片內(nèi)信號(hào)調(diào)節(jié)、溫度補(bǔ)償和校準(zhǔn)功能) |
| MPX2102D | 100kPa On-Chip Temperature Compensated & Calibrated Silicon Pressure Sensors(100kPa片內(nèi)溫度補(bǔ)償和校準(zhǔn)硅壓力傳感器) |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MPX2300DT1_10 | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:High Volume Pressure Sensor for Disposable Applications |
| MPX2300DT1_12 | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:High Volume Pressure Sensor for Disposable Applications |
| MPX2301DT1 | 功能描述:板上安裝壓力/力傳感器 CHIP PAK RoHS:否 制造商:Honeywell 工作壓力:0 bar to 4 bar 壓力類型:Gage 準(zhǔn)確性:+ / - 0.25 % 輸出類型:Digital 安裝風(fēng)格:Through Hole 工作電源電壓:5 V 封裝 / 箱體:SIP 端口類型:Dual Radial Barbed, Same sides |
| MPX240D5 | 功能描述:固態(tài)繼電器-PCB安裝 SSR PCB Mount 280V AC 5 AMP RoHS:否 制造商:Omron Electronics 控制電壓范圍: 負(fù)載電壓額定值:40 V 負(fù)載電流額定值:120 mA 觸點(diǎn)形式:1 Form A (SPST-NO) 輸出設(shè)備:MOSFET 封裝 / 箱體:USOP-4 安裝風(fēng)格:SMD/SMT |
| MPX240D5R | 功能描述:固態(tài)繼電器-PCB安裝 SSR PCB Mount 280V AC 5 AMP RoHS:否 制造商:Omron Electronics 控制電壓范圍: 負(fù)載電壓額定值:40 V 負(fù)載電流額定值:120 mA 觸點(diǎn)形式:1 Form A (SPST-NO) 輸出設(shè)備:MOSFET 封裝 / 箱體:USOP-4 安裝風(fēng)格:SMD/SMT |
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