3–130
Motorola Sensor Device Data
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Motorola’s MPXA6115A/MPXH6115A series sensor integrates on–chip, bipolar op amp
circuitry and thin film resistor networks to provide a high output signal and temperature
compensation. The small form factor and high reliability of on–chip integration make the
Motorola pressure sensor a logical and economical choice for the system designer.
The MPXA6115A/MPXH6115A series piezoresistive
transducer is a state–of–the–art, monolithic, signal
conditioned, silicon pressure sensor. This sensor
combines advanced micromachining techniques, thin
film metallization, and bipolar semiconductor processing
to provide an accurate, high level analog output signal
that is proportional to applied pressure.
Figure 1 shows a block diagram of the internal
circuitry integrated on a pressure sensor chip.
Features
Improved Accuracy at High Temperature
Available in Small and Super Small Outline
Packages
1.5% Maximum Error over 0
°
to 85
°
C
Ideally suited for Microprocessor or
Microcontroller–Based Systems
Temperature Compensated from –40
°
to +125
°
C
Durable Thermoplastic (PPS) Surface Mount
Package
Application Examples
Aviation Altimeters
Industrial Controls
Engine Control/Manifold Absolute Pressure (MAP)
Weather Station and Weather Reporting Device
Barometers
Figure 1. Fully Integrated Pressure Sensor
Schematic
VS
SENSING
ELEMENT
Vout
GND
THIN FILM
TEMPERATURE
COMPENSATION
AND
GAIN STAGE #1
GAIN STAGE #2
AND
GROUND
REFERENCE
SHIFT CIRCUITRY
PINS 1, 5, 6, 7 AND 8 ARE NO CONNECTS
SEMICONDUCTOR TECHNICAL DATA
INTEGRATED
PRESSURE SENSOR
15 to 115 kPa (2.2 to 16.7 psi)
0.2 to 4.8 Volts Output
PIN NUMBER
NOTE: Pins 1, 5, 6, 7, and 8 are
internal device connections. Do not
connect to external circuitry or
ground. Pin 1 is denoted by the notch
in the lead.
1
2
3
N/C
VS
Gnd
5
6
7
N/C
N/C
N/C
MPXA6115A6U
CASE 482
MPXA6115AC6U
CASE 482A
4
Vout
8
N/C
SMALL OUTLINE PACKAGE
PIN NUMBER
NOTE: Pins 1, 5, 6, 7, and 8 are
internal device connections. Do not
connect to external circuitry or
ground. Pin 1 is denoted by the
chamfered corner of the package.
1
2
3
N/C
VS
Gnd
5
6
7
N/C
N/C
N/C
MPXH6115A6U
CASE 1317
MPXH6115AC6U
CASE 1317A
4
Vout
8
N/C
SUPER SMALL OUTLINE
PACKAGE
REV 1
F
Freescale Semiconductor, Inc.
n
.