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參數資料
| 型號： | MPD70F3226GC(A)-8EU |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | RISC MICROCONTROLLER, PQFP100 |
| 封裝： | 14 X 14 MM, 0.50 MM PITCH, LQFP-100 |
| 文件頁數： | 31/41頁 |
| 文件大?。?/td> | 355K |
| 代理商： | MPD70F3226GC(A)-8EU |
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DATA SHEET U15871EE1V2DS00
PD70F3224, PD70F3226
4.
Recommended Soldering Conditions
Solder this product under the following recommended conditions.
For details of the recommended soldering conditions, refer to information document Semiconductor
Device:
Mounting Technology Manual (C10535E).
For soldering methods and conditions other than those recommended please consult NEC.
Note: The number of days refers to storage at 25°C, 65% RH MAX after the dry pack has been
opened.
After that, prebaking is necessary at 125 °C for 10 to 72 hours.
Caution:
Do not use two or more soldering methods in combination (except partial heating
method).
Table 4-1:
Soldering Conditions
Soldering Method
Soldering Condition
Symbol of Recommended Soldering
Condition
Infrared reflow
Package peak temperature: 235°C,
Time: 30 seconds max. (210°C min.),
Number of times: 3 max.,
Number of days: 7 Note
IR35-107-3
VPS
Package peak temperature: 215°C,
Time: 30 seconds max. (210°C min.),
Number of times: 2 max.,
Number of days: 7 Note
VP15-207-2
Partial heating
Pin temperature: 300°C max.,
Time: 3 seconds max. (per side of device)
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