參數(shù)資料
型號(hào)： MPC880ZP133
廠商： MOTOROLA INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 133 MHz, RISC PROCESSOR, PBGA357
封裝： 25 X 25 MM, 1.27 MM PITCH, PLASTIC, MS-034BAK-1, BGA-357
文件頁數(shù)： 2/92頁
文件大?。?/td> 1499K
代理商： MPC880ZP133
10
MPC885/MPC880 Hardware Specifications
MOTOROLA
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Thermal Characteristics
4
Thermal Characteristics
Table 4 shows the thermal characteristics for the MPC885/880.
5
Power Dissipation
Table 5 provides information on power dissipation. The modes are 1:1, where CPU and bus speeds are
equal, and 2:1, where CPU frequency is twice bus speed.
Table 4. MPC885/880 Thermal Resistance Data
Rating
Environment
Symbol
Value
Unit
Junction-to-ambient 1
1 Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal
resistance.
Natural convection
Single-layer board (1s)
RθJA
2
2 Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
37
°C/W
Four-layer board (2s2p)
RθJMA
3
3 Per JEDEC JESD51-6 with the board horizontal
25
Airflow (200 ft/min)
Single-layer board (1s)
RθJMA
30
Four-layer board (2s2p)
RθJMA
22
Junction-to-board 4
4 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is
measured on the top surface of the board near the package.
RθJB
17
Junction-to-case 5
5 Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate
method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature. For exposed
pad packages where the pad would be expected to be soldered, junction-to-case thermal resistance is a simulated
value from the junction to the exposed pad without contact resistance.
RθJC
10
Junction-to-package top 6
6 Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2.
Natural convection
ΨJT
2
Airflow (200 ft/min)
ΨJT
2
Table 5. Power Dissipation (PD)
Die Revision
Bus
Mode
CPU
Frequency
Typical 1
1 Typical power dissipation at V
DDL = VDDSYN = 1.8 V, and VDDH is at 3.3 V.
Maximum 2
Unit
0
1:1
66 MHz
310
390
mW
80 MHz
350
430
mW
2:1
133 MHz
430
495
mW
相關(guān)PDF資料
PDF描述
MPC9159DWR2 66 MHz, PROC SPECIFIC CLOCK GENERATOR, CDSO28
MPC9230AC 750 MHz, OTHER CLOCK GENERATOR, PQFP32
MPC9230EIR2 750 MHz, OTHER CLOCK GENERATOR, PQCC28
MPC9239ACR2 900 MHz, OTHER CLOCK GENERATOR, PQFP32
MPC9239EIR2 900 MHz, OTHER CLOCK GENERATOR, PQCC28
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC880ZP66 功能描述:微處理器 - MPU PQ I HIP6W DUET RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC880ZP80 功能描述:微處理器 - MPU PQ I HIP6W DUET RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC885ADS 功能描述:開發(fā)板和工具包 - 其他處理器 DUET885 RoHS:否 制造商:Freescale Semiconductor 產(chǎn)品:Development Systems 工具用于評(píng)估:P3041 核心:e500mc 接口類型:I2C, SPI, USB 工作電源電壓:
MPC885ADSE 功能描述:開發(fā)板和工具包 - 其他處理器 DUET885 RoHS:否 制造商:Freescale Semiconductor 產(chǎn)品:Development Systems 工具用于評(píng)估:P3041 核心:e500mc 接口類型:I2C, SPI, USB 工作電源電壓:
MPC885CVR133 功能描述:微處理器 - MPU 133 MHz 176 MIPS RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。

采購需求

(若只采購一條型號(hào)，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購

我的聯(lián)系方式

*
*
*