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參數(shù)資料
| 型號(hào)： | MPC870CZT66 |
| 廠商： | Freescale Semiconductor |
| 文件頁(yè)數(shù)： | 6/84頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | IC MPU POWERQUICC 66MHZ 256PBGA |
| 標(biāo)準(zhǔn)包裝： | 60 |
| 系列： | MPC8xx |
| 處理器類型： | 32-位 MPC8xx PowerQUICC |
| 速度： | 66MHz |
| 電壓： | 3.3V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 256-BGA |
| 供應(yīng)商設(shè)備封裝： | 256-PBGA（23x23） |
| 包裝： | 托盤 |
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MPC875/MPC870 PowerQUICC Hardware Specifications, Rev. 4
14
Freescale Semiconductor
Power Supply and Power Sequencing
7.5
Experimental Determination
To determine the junction temperature of the device in the application after prototypes are available, the
thermal characterization parameter (
ΨJT) can be used to determine the junction temperature with a
measurement of the temperature at the top center of the package case using the following equation:
TJ = TT + (ΨJT × PD)
where:
ΨJT = thermal characterization parameter
TT = thermocouple temperature on top of package
PD = power dissipation in package
The thermal characterization parameter is measured per the JESD51-2 specification published by JEDEC
using a 40 gauge type T thermocouple epoxied to the top center of the package case. The thermocouple
should be positioned so that the thermocouple junction rests on the package. A small amount of epoxy is
placed over the thermocouple junction and over about 1 mm of wire extending from the junction. The
thermocouple wire is placed flat against the package case to avoid measurement errors caused by the
cooling effects of the thermocouple wire.
7.6
References
Semiconductor Equipment and Materials International
(415) 964-5111
805 East Middlefield Rd
Mountain View, CA 94043
MIL-SPEC and EIA/JESD (JEDEC) specifications
800-854-7179 or
(Available from Global Engineering Documents)
303-397-7956
JEDEC Specifications
http://www.jedec.org
1. C.E. Triplett and B. Joiner, “An Experimental Characterization of a 272 PBGA Within an
Automotive Engine Controller Module,” Proceedings of SemiTherm, San Diego, 1998, pp. 47–54.
2. 2. B. Joiner and V. Adams, “Measurement and Simulation of Junction to Board Thermal
Resistance and Its Application in Thermal Modeling,” Proceedings of SemiTherm, San Diego,
1999, pp. 212–220.
8
Power Supply and Power Sequencing
This section provides design considerations for the MPC875/MPC870 power supply. The
MPC875/MPC870 has a core voltage (VDDL) and PLL voltage (VDDSYN), which both operate at a lower
voltage than the I/O voltage (VDDH). The I/O section of the MPC875/MPC870 is supplied with 3.3 V
across VDDH and VSS (GND).
The signals PA[0:3], PA[8:11], PB15, PB[24:25], PB[28:31], PC[4:7], PC[12:13], PC15, PD[3:15], TDI,
TDO, TCK, TRST, TMS, MII_TXEN, and MII_MDIO are 5 V tolerant. No input can be more than 2.5 V
greater than VDDH. In addition, 5-V tolerant pins cannot exceed 5.5 V, and remaining input pins cannot
exceed 3.465 V. This restriction applies to power up, power down, and normal operation.
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