參數(shù)資料
型號(hào)： MPC862PZQ66B
廠商： Freescale Semiconductor
文件頁(yè)數(shù)： 2/88頁(yè)
文件大小： 0K
描述： IC MPU PWRQUICC 66MHZ 357-PBGA
標(biāo)準(zhǔn)包裝： 44
系列： MPC8xx
處理器類(lèi)型： 32-位 MPC8xx PowerQUICC
速度： 66MHz
電壓： 3.3V
安裝類(lèi)型： 表面貼裝
封裝/外殼： 357-BBGA
供應(yīng)商設(shè)備封裝： 357-PBGA（25x25）
包裝： 托盤(pán)
MPC862/857T/857DSL PowerQUICC Family Hardware Specifications, Rev. 3
10
Freescale Semiconductor
Thermal Characteristics
4
Thermal Characteristics
Table 3 shows the thermal characteristics for the MPC862/857T/857DSL.
5
Power Dissipation
Table 4 provides power dissipation information. The modes are 1:1, where CPU and bus speeds are equal,
and 2:1 mode, where CPU frequency is twice bus speed.
Table 3. MPC862/857T/857DSL Thermal Resistance Data
Rating
Environment
Symbol
Value
Unit
Junction to ambient 1
1
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board,
and board thermal resistance.
Natural Convection
Single layer board (1s)
RθJA
2
Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
37
°C/W
Four layer board (2s2p)
RθJMA
3
Per JEDEC JESD51-6 with the board horizontal.
23
Air flow (200 ft/min)
Single layer board (1s)
RθJMA
30
Four layer board (2s2p)
RθJMA
19
Junction to board 4
4
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature
is measured on the top surface of the board near the package.
RθJB
13
Junction to case 5
5
Indicates the average thermal resistance between the die and the case top surface as measured by the cold
plate method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case
temperature. For exposed pad packages where the pad would be expected to be soldered, junction to case
thermal resistance is a simulated value from the junction to the exposed pad without contact resistance.
RθJC
6
Junction to package top 6
6
Thermal characterization parameter indicating the temperature difference between package top and the
junction temperature per JEDEC JESD51-2.
Natural Convection
ΨJT
2
Air flow (200 ft/min)
ΨJT
2
Table 4. Power Dissipation (PD)
Die Revision
Frequency
Typical 1
Maximum 2
Unit
0
(1:1 Mode)
50 MHz
656
735
mW
66 MHz
TBD
mW
A.1, B.0
(1:1 Mode)
50 MHz
630
760
mW
66 MHz
890
1000
mW
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