- 您現(xiàn)在的位置：買賣IC網 > PDF目錄369928 > MPC860SRZP40 (Motorola, Inc.) ATM communication controller PDF資料下載
參數(shù)資料
| 型號： | MPC860SRZP40 |
| 廠商： | Motorola, Inc. |
| 英文描述： | ATM communication controller |
| 中文描述： | 自動柜員機通信控制器 |
| 文件頁數(shù)： | 11/76頁 |
| 文件大?。?/td> | 857K |
| 代理商： | MPC860SRZP40 |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁當前第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁第62頁第63頁第64頁第65頁第66頁第67頁第68頁第69頁第70頁第71頁第72頁第73頁第74頁第75頁第76頁
MOTOROLA
MPC860 Family Hardware Specifications
11
Estimation with Junction-to-Board Thermal Resistance
where:
R
θ
JA
= junction-to-ambient thermal resistance (oC/W)
R
θ
JC
= junction-to-case thermal resistance (oC/W)
R
θ
CA
= case-to-ambient thermal resistance (oC/W)
R
θ
JC
is device related and cannot be influenced by the user. The user adjusts the thermal
environment to affect the case-to-ambient thermal resistance, R
θ
CA
. For instance, the user
can change the air flow around the device, add a heat sink, change the mounting
arrangement on the printed circuit board, or change the thermal dissipation on the printed
circuit board surrounding the device. This thermal model is most useful for ceramic
packages with heat sinks where some 90% of the heat flows through the case and the heat
sink to the ambient environment. For most packages, a better model is required.
7.3
Estimation with Junction-to-Board Thermal
Resistance
A simple package thermal model which has demonstrated reasonable accuracy (about 20%)
is a two resistor model consisting of a junction-to-board and a junction-to-case thermal
resistance. The junction-to-case covers the situation where a heat sink is used or where a
substantial amount of heat is dissipated from the top of the package. The junction-to-board
thermal resistance describes the thermal performance when most of the heat is conducted
to the printed circuit board. It has been observed that the thermal performance of most
plastic packages and especially PBGA packages is strongly dependent on the board
temperature; see Figure 7-1.
Figure 7-1. Effect of Board Temperature Rise on Thermal Behavior
0
10
20
30
40
50
60
70
80
90
100
0
20
40
60
80
Board Temperture Rise Above Ambient Divided by Package
J
A
J
A
相關PDF資料 |
PDF描述 |
|---|---|
| MPC860SRZP50 | ATM communication controller |
| MPC860UM | SEE A3281LLT-T |
| MPC860UMAD | CHOPPER STABILIZED LATCH W/TIN PLATING |
| MPC860EC | Family Hardware Specifications |
| MPC860ED | Family Hardware Specifications |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| MPC860SRZQ50D4 | 功能描述:微處理器 - MPU POWER QUICC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC860SRZQ50D4 | 制造商:Freescale Semiconductor 功能描述:IC 32BIT MPU 50MHZ BGA-357 |
| MPC860SRZQ50D4R2 | 功能描述:微處理器 - MPU POWER QUICC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC860SRZQ66D4 | 功能描述:微處理器 - MPU POWER QUICC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC860SRZQ66D4R2 | 功能描述:微處理器 - MPU POWER QUICC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
發(fā)布緊急采購，3分鐘左右您將得到回復。