參數(shù)資料
型號(hào)： MPC860SRZP25
廠商： Motorola, Inc.
英文描述： ATM communication controller
中文描述： 自動(dòng)柜員機(jī)通信控制器
文件頁(yè)數(shù)： 7/76頁(yè)
文件大小： 857K
代理商： MPC860SRZP25
MOTOROLA
MPC860 Family Hardware Specifications
7
Thermal Characteristics
Part IV Thermal Characteristics
Table 4-3 shows the thermal characteristics for the MPC860.
Table 3-2. Maximum Tolerated Ratings
(GND = 0 V)
Rating
Symbol
Value
Unit
Supply Voltage
1
1
The power supply of the device must start its ramp from 0.0 V.
Functional operating conditions are provided with the DC electrical specifications in Table 6-5. Absolute maximum
ratings are stress ratings only; functional operation at the maxima is not guaranteed. Stress beyond those listed may
affect device reliability or cause permanent damage to the device.
Caution
: All inputs that tolerate 5 V cannot be more than 2.5 V greater than the supply voltage. This restriction applies
to power-up and normal operation (that is, if the MPC860 is unpowered, voltage greater than 2.5 V must not be
applied to its inputs).
Minimum temperatures are guaranteed as ambient temperature, T
junction temperature, T
j
.
V
DDH
–0.3 to 4.0
V
V
DDL
–0.3 to 4.0
V
KAPWR
–0.3 to 4.0
V
VDDSYN
–0.3 to 4.0
V
Input Voltage
2
2
V
in
GND – 0.3 to VDDH
V
Temperature
3
(Standard)
3
A
. Maximum temperatures are guaranteed as
T
A(min)
0
C
T
j(max)
95
C
Temperature
3
(Extended)
T
A(min)
–40
C
T
j(max)
95
C
Storage Temperature Range
T
stg
–55 to 150
C
Table 4-3. MPC860 Thermal Resistance Data
Rating
Environment
Symbol
Rev A
Rev
B, C, D
Unit
Junction to Ambient
1
1
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
Natural Convection
Single layer board (1s)
R
θ
JMA 3
JA 2
31
40
°C/W
Four layer board (2s2p)
R
θ
20
25
Air Flow (200 ft/min)
Single layer board (1s)
R
θ
JMA3
26
32
Four layer board (2s2p)
R
θ
JMA3
16
21
Junction to Board
4
R
θ
JB
8
15
Junction to Case
5
R
θ
JC
5
7
Junction to Package Top
6
Natural Convection
Ψ
JT
1
2
Air Flow (200 ft/min)
2
3
相關(guān)PDF資料
PDF描述
MPC860SRZP40 ATM communication controller
MPC860SRZP50 ATM communication controller
MPC860UM SEE A3281LLT-T
MPC860UMAD CHOPPER STABILIZED LATCH W/TIN PLATING
MPC860EC Family Hardware Specifications
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC860SRZQ50D4 功能描述:微處理器 - MPU POWER QUICC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線(xiàn)寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC860SRZQ50D4 制造商:Freescale Semiconductor 功能描述:IC 32BIT MPU 50MHZ BGA-357
MPC860SRZQ50D4R2 功能描述:微處理器 - MPU POWER QUICC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線(xiàn)寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC860SRZQ66D4 功能描述:微處理器 - MPU POWER QUICC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線(xiàn)寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC860SRZQ66D4R2 功能描述:微處理器 - MPU POWER QUICC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線(xiàn)寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫(xiě)一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*