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參數(shù)資料
| 型號： | MPC860EN |
| 廠商： | Motorola, Inc. |
| 英文描述： | Family Hardware Specifications |
| 中文描述： | 家庭硬件規(guī)格 |
| 文件頁數(shù)： | 11/76頁 |
| 文件大?。?/td> | 857K |
| 代理商： | MPC860EN |
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MOTOROLA
MPC860 Family Hardware Specifications
11
Estimation with Junction-to-Board Thermal Resistance
where:
R
θ
JA
= junction-to-ambient thermal resistance (oC/W)
R
θ
JC
= junction-to-case thermal resistance (oC/W)
R
θ
CA
= case-to-ambient thermal resistance (oC/W)
R
θ
JC
is device related and cannot be influenced by the user. The user adjusts the thermal
environment to affect the case-to-ambient thermal resistance, R
θ
CA
. For instance, the user
can change the air flow around the device, add a heat sink, change the mounting
arrangement on the printed circuit board, or change the thermal dissipation on the printed
circuit board surrounding the device. This thermal model is most useful for ceramic
packages with heat sinks where some 90% of the heat flows through the case and the heat
sink to the ambient environment. For most packages, a better model is required.
7.3
Estimation with Junction-to-Board Thermal
Resistance
A simple package thermal model which has demonstrated reasonable accuracy (about 20%)
is a two resistor model consisting of a junction-to-board and a junction-to-case thermal
resistance. The junction-to-case covers the situation where a heat sink is used or where a
substantial amount of heat is dissipated from the top of the package. The junction-to-board
thermal resistance describes the thermal performance when most of the heat is conducted
to the printed circuit board. It has been observed that the thermal performance of most
plastic packages and especially PBGA packages is strongly dependent on the board
temperature; see Figure 7-1.
Figure 7-1. Effect of Board Temperature Rise on Thermal Behavior
0
10
20
30
40
50
60
70
80
90
100
0
20
40
60
80
Board Temperture Rise Above Ambient Divided by Package
J
A
J
A
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MPC860ENCVR50D4 | 功能描述:微處理器 - MPU POWER QUICC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC860ENCVR66D4 | 功能描述:微處理器 - MPU POWER QUICC-NO LEAD RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC860ENCZQ50D4 | 功能描述:微處理器 - MPU POWER QUICC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC860ENCZQ66D4 | 功能描述:微處理器 - MPU POWER QUICC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC860ENVR50D4 | 功能描述:微處理器 - MPU POWER QUICC-NO LEAD RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
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