參數(shù)資料
型號(hào): MPC8572EVTAULB
廠商: Freescale Semiconductor
文件頁數(shù): 72/138頁
文件大?。?/td> 0K
描述: MPU POWERQUICC III 1023-PBGA
標(biāo)準(zhǔn)包裝: 1
系列: MPC85xx
處理器類型: 32-位 MPC85xx PowerQUICC III
速度: 1.333GHz
電壓: 1.1V
安裝類型: 表面貼裝
封裝/外殼: 1023-BBGA,F(xiàn)CBGA
供應(yīng)商設(shè)備封裝: 1023-FCPBGA(33x33)
包裝: 托盤
MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 5
Freescale Semiconductor
39
Ethernet: Enhanced Three-Speed Ethernet (eTSEC)
Figure 17 shows the TBI receive the timing diagram.
Figure 17. TBI Single-Clock Mode Receive AC Timing Diagram
8.2.6
RGMII and RTBI AC Timing Specifications
Table 34 presents the RGMII and RTBI AC timing specifications.
Table 34. RGMII and RTBI AC Timing Specifications
At recommended operating conditions with LVDD/TVDD of 2.5 V ± 5%.
Parameter/Condition
Symbol 1
Min
Typ
Max
Unit
Data to clock output skew (at transmitter)
tSKRGT
–500
0
500
ps
Data to clock input skew (at receiver) 2
tSKRGT
1.0
2.8
ns
Clock period 3
tRGT
7.2
8.0
8.8
ns
Duty cycle for 10BASE-T and 100BASE-TX 3, 4
tRGTH/tRGT
40
50
60
%
Rise time (20%–80%)
tRGTR
0.75
ns
Fall time (20%–80%)
tRGTF
0.75
ns
Notes:
1. Note that, in general, the clock reference symbol representation for this section is based on the symbols RGT to represent
RGMII and RTBI timing. For example, the subscript of tRGT represents the TBI (T) receive (RX) clock. Note also that the
notation for rise (R) and fall (F) times follows the clock symbol that is being represented. For symbols representing skews, the
subscript is skew (SK) followed by the clock that is being skewed (RGT).
2. This implies that PC board design requires clocks to be routed such that an additional trace delay of greater than 1.5 ns will
be added to the associated clock signal.
3. For 10 and 100 Mbps, tRGT scales to 400 ns ± 40 ns and 40 ns ± 4 ns, respectively.
4. Duty cycle may be stretched/shrunk during speed changes or while transitioning to a received packet's clock domains as long
as the minimum duty cycle is not violated and stretching occurs for no more than three tRGT of the lowest speed transitioned
between.
tTRR
tTRRH
tTRRF
tTRRR
RX_CLK
RCG[9:0]
valid data
tTRRDX
tTRRDV
相關(guān)PDF資料
PDF描述
396-020-541-202 CARD EDGE 20POS DL .125X.250 BLK
396-020-541-201 CARD EDGE 20POS DL .125X.250 BLK
HFW15R-1STE1LF CONN FPC/FFC 15POS 1MM R/A SMD
MC8641HX1000GE IC DUAL CORE PROCESSOR 994-CBGA
346-020-521-204 CARDEDGE 20POS DUAL .125 GREEN
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8572EVTAULD 功能描述:微處理器 - MPU 32-BIT CMOS 1.333GHz RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8572EVTAULE 功能描述:微處理器 - MPU 38H R211 Enc NoPb 1333 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8572EVTAVNB 功能描述:微處理器 - MPU RV1.1.1 1500 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8572EVTAVND 功能描述:微處理器 - MPU 32-BIT CMOS 1.5GHz RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8572EVTAVNE 功能描述:微處理器 - MPU 38H R211 Enc NoPb 1500 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324