參數(shù)資料
型號: MPC8572ELVTAVNE
廠商: Freescale Semiconductor
文件頁數(shù): 69/138頁
文件大小: 0K
描述: MPU POWERQUICC III 1023FCPBGA
標準包裝: 1
系列: MPC85xx
處理器類型: 32-位 MPC85xx PowerQUICC III
速度: 1.5GHz
電壓: 1.1V
安裝類型: 表面貼裝
封裝/外殼: 1023-BBGA,F(xiàn)CBGA
供應商設(shè)備封裝: 1023-FCPBGA(33x33)
包裝: 托盤
MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 5
36
Freescale Semiconductor
Ethernet: Enhanced Three-Speed Ethernet (eTSEC)
Figure 14 shows the MII receive AC timing diagram.
Figure 14. MII Receive AC Timing Diagram
8.2.4
TBI AC Timing Specifications
This section describes the TBI transmit and receive AC timing specifications.
8.2.4.1
TBI Transmit AC Timing Specifications
Table 31 provides the TBI transmit AC timing specifications.
Table 31. TBI Transmit AC Timing Specifications
At recommended operating conditions with LVDD/TVDD of 2.5/ 3.3 V ± 5%.
Parameter/Condition
Symbol 1
Min
Typ
Max
Unit
TCG[9:0] setup time GTX_CLK going high
tTTKHDV
2.0
ns
TCG[9:0] hold time from GTX_CLK going high
tTTKHDX
1.0
ns
GTX_CLK rise (20%–80%)
tTTXR
2
——
1.0
ns
GTX_CLK fall time (80%–20%)
tTTXF
2
——
1.0
ns
Notes:
1. The symbols used for timing specifications herein follow the pattern of t(first two letters of functional block)(signal)(state
)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example,
tTTKHDV symbolizes the TBI transmit timing (TT) with respect to the time from tTTX (K) going high (H) until the
referenced data signals (D) reach the valid state (V) or setup time. Also, tTTKHDX symbolizes the TBI transmit timing
(TT) with respect to the time from tTTX (K) going high (H) until the referenced data signals (D) reach the invalid state
(X) or hold time. Note that, in general, the clock reference symbol representation is based on three letters
representing the clock of a particular functional. For example, the subscript of tTTX represents the TBI (T) transmit
(TX) clock. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall).
2. Guaranteed by design.
RX_CLK
RXD[3:0]
tMRDXKL
tMRX
tMRXH
tMRXR
tMRXF
RX_DV
RX_ER
tMRDVKH
Valid Data
相關(guān)PDF資料
PDF描述
AMC50DRAN-S734 CONN EDGECARD 100PS .100 R/A PCB
MC8640DVU1067NE IC MPU DUAL CORE E600 1023FCCBGA
XF3B-514531AE CONN FPC 51POS .3MM SMT DBL SIDE
AMC50DRAH-S734 CONN EDGECARD 100PS .100 R/A PCB
AMC49DRAI-S734 CONN EDGECARD 98POS .100 R/A PCB
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8572EPXARLB 功能描述:微處理器 - MPU RV1.1.1 SNPB 1067 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8572EPXARLD 功能描述:微處理器 - MPU 32-BIT CMOS 1.067GHz RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8572EPXARLE 功能描述:微處理器 - MPU 38H R211 Enc SnPb 1067 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8572EPXATLB 功能描述:微處理器 - MPU RV1.1.1 SNPB 1200 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8572EPXATLD 功能描述:微處理器 - MPU 32-BIT CMOS 1.2GHz RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324