參數(shù)資料
型號(hào)： MPC8572ECVTARNB
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 1067 MHz, MICROPROCESSOR, PBGA1023
封裝： 33 X 33 MM, LEAD FREE, PLASTIC, FCBGA-1023
文件頁數(shù)： 129/138頁
文件大小： 1502K
代理商： MPC8572ECVTARNB
MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 2
90
Freescale Semiconductor
Serial RapidIO
16.5.1
Compliance Test and Measurement Load
The AC timing and voltage parameters must be verified at the measurement point, as specified within 0.2
inches of the package pins, into a test/measurement load shown in Figure 57.
NOTE
The allowance of the measurement point to be within 0.2 inches of the
package pins is meant to acknowledge that package/board routing may
benefit from D+ and D– not being exactly matched in length at the package
pin boundary.
Figure 57. Compliance Test/Measurement Load
17 Serial RapidIO
This section describes the DC and AC electrical specifications for the RapidIO interface of the MPC8572E
for the LP-Serial physical layer. The electrical specifications cover both single and multiple-lane links.
Two transmitters (short run and long run) and a single receiver are specified for each of three baud rates,
1.25, 2.50, and 3.125 GBaud.
Two transmitter specifications allow for solutions ranging from simple board-to-board interconnect to
driving two connectors across a backplane. A single receiver specification is given that will accept signals
from both the short run and long run transmitter specifications.
The short run transmitter should be used mainly for chip-to-chip connections on either the same printed
circuit board or across a single connector. This covers the case where connections are made to a mezzanine
(daughter) card. The minimum swings of the short run specification reduce the overall power used by the
transceivers.
The long run transmitter specifications use larger voltage swings that are capable of driving signals across
backplanes. This allows a user to drive signals across two connectors and a backplane. The specifications
allow a distance of at least 50 cm at all baud rates.
All unit intervals are specified with a tolerance of +/– 100 ppm. The worst case frequency difference
between any transmit and receive clock will be 200 ppm.
相關(guān)PDF資料
PDF描述
MPC8572ECPXARLD 32-BIT, 1067 MHz, MICROPROCESSOR, PBGA1023
MPC8572ECVTAVLD 32-BIT, 1500 MHz, MICROPROCESSOR, PBGA1023
MPC8572CVTAVND 32-BIT, 1500 MHz, MICROPROCESSOR, PBGA1023
MPC8572ECPXATND 32-BIT, 1200 MHz, MICROPROCESSOR, PBGA1023
MPC8572ECVTARLD 32-BIT, 1067 MHz, MICROPROCESSOR, PBGA1023
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8572ECVTAULB 功能描述:微處理器 - MPU RV1.1.1 1333 EXT T RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8572ECVTAULD 功能描述:微處理器 - MPU 1333 EXT TEMP RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8572ECVTAULE 功能描述:微處理器 - MPU R211 Enc NoPb 1333 Ext RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8572ECVTAVND 功能描述:微處理器 - MPU 1500 ExtTmp RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8572ECVTAVNE 功能描述:微處理器 - MPU R211 Enc NoPb 1500 Ext RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
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