參數(shù)資料
型號: MPC8572ECVTARLE
廠商: Freescale Semiconductor
文件頁數(shù): 53/138頁
文件大?。?/td> 0K
描述: MPU POWERQUICC III 1023FCPBGA
標(biāo)準(zhǔn)包裝: 1
系列: MPC85xx
處理器類型: 32-位 MPC85xx PowerQUICC III
速度: 1.067GHz
電壓: 1.1V
安裝類型: 表面貼裝
封裝/外殼: 1023-BBGA,F(xiàn)CBGA
供應(yīng)商設(shè)備封裝: 1023-FCPBGA(33x33)
包裝: 托盤
MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 5
Freescale Semiconductor
21
DDR2 and DDR3 SDRAM Controller
this section for DDR3 is applicable for data rate between 606 MHz and 800 MHz, as long as the DC and
AC specifications of the DDR3 memory to be used are compliant to both JEDEC specifications as well as
the specifications and requirements described in this MPC8572E hardware specifications document.
6.2.1
DDR2 and DDR3 SDRAM Interface Input AC Timing Specifications
Table 15, Table 16, and Table 17 provide the input AC timing specifications for the DDR controller when
interfacing to DDR2 and DDR3 SDRAM.
Table 15. DDR2 SDRAM Interface Input AC Timing Specifications for 1.8-V Interface
At recommended operating conditions with GVDD of 1.8 V ± 5%
Parameter
Symbol
Min
Max
Unit
Notes
AC input low voltage
>=667 MHz
VILAC
—MVREFn – 0.20
V
<= 533 MHz
MVREFn – 0.25
AC input high voltage
>=667 MHz
VIHAC
MVREFn + 0.20
V
<= 533 MHz
MVREFn + 0.25
Table 16. DDR3 SDRAM Interface Input AC Timing Specifications for 1.5-V Interface
At recommended operating conditions with GVDD of 1.5 V ± 5%. DDR3 data rate is between 606 MHz and 800 MHz.
Parameter
Symbol
Min
Max
Unit
Notes
AC input low voltage
VILAC
—MVREFn – 0.175
V
AC input high voltage
VIHAC
MVREFn + 0.175
V
Table 17. DDR2 and DDR3 SDRAM Interface Input AC Timing Specifications
At recommended operating conditions with GVDD of 1.8 V ± 5% for DDR2 or 1.5 V ± 5% for DDR3.
Parameter
Symbol
Min
Max
Unit
Notes
Controller Skew for MDQS—MDQ/MECC
tCISKEW
ps
1, 2
800 MHz
–200
200
667 MHz
–240
240
533 MHz
–300
300
400 MHz
–365
365
Note:
1. tCISKEW represents the total amount of skew consumed by the controller between MDQS[n] and any corresponding
bit that is captured with MDQS[n]. This should be subtracted from the total timing budget.
2. The amount of skew that can be tolerated from MDQS to a corresponding MDQ signal is called tDISKEW.This can be
determined by the following equation: tDISKEW =+/–(T/4 – abs(tCISKEW)) where T is the clock period and
abs(tCISKEW) is the absolute value of tCISKEW.
相關(guān)PDF資料
PDF描述
IDT7007L55PF8 IC SRAM 256KBIT 55NS 80TQFP
IDT7133LA25PFI IC SRAM 32KBIT 25NS 100TQFP
MC7448TVU1000ND MPU 128BIT 1000MHZ 360-CBGA
IDT70V05L20JI IC SRAM 64KBIT 20NS 68PLCC
IDT70V05L15JG IC SRAM 64KBIT 15NS 68PLCC
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8572ECVTAULB 功能描述:微處理器 - MPU RV1.1.1 1333 EXT T RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8572ECVTAULD 功能描述:微處理器 - MPU 1333 EXT TEMP RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8572ECVTAULE 功能描述:微處理器 - MPU R211 Enc NoPb 1333 Ext RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8572ECVTAVND 功能描述:微處理器 - MPU 1500 ExtTmp RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8572ECVTAVNE 功能描述:微處理器 - MPU R211 Enc NoPb 1500 Ext RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324