參數(shù)資料
型號(hào)： MPC8572ECVTARLD
廠商： Freescale Semiconductor
文件頁數(shù)： 26/138頁
文件大?。?/td> 0K
描述： MPU POWERQUICC III 1023-PBGA
標(biāo)準(zhǔn)包裝： 1
系列： MPC85xx
處理器類型： 32-位 MPC85xx PowerQUICC III
速度： 1.067GHz
電壓： 1.1V
安裝類型： 表面貼裝
封裝/外殼： 1023-BBGA，F(xiàn)CBGA
供應(yīng)商設(shè)備封裝： 1023-FCPBGA（33x33）
包裝： 托盤
MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 5
Freescale Semiconductor
121
Thermal
19.5.2
Minimum Platform Frequency Requirements for High-Speed
Interfaces
Section 4.4.3.6, “I/O Port Selection,” in the MPC8572E PowerQUICC III Integrated Host Processor
Family Reference Manual describes various high-speed interface configuration options. Note that the CCB
clock frequency must be considered for proper operation of such interfaces as described below.
For proper PCI Express operation, the CCB clock frequency must be greater than or equal to:
See Section 21.1.3.2, “Link Width,” in the MPC8572E PowerQUICC III Integrated Host Processor
Family Reference Manual for PCI Express interface width details. Note that the “PCI Express link width”
in the above equation refers to the negotiated link width as the result of PCI Express link training, which
may or may not be the same as the link width POR selection.
For proper serial RapidIO operation, the CCB clock frequency must be greater than:
See Section 20.4, “1x/4x LP-Serial Signal Descriptions,” in the MPC8572E PowerQUICC III Integrated
Host Processor Family Reference Manual for Serial RapidIO interface width and frequency details.
20 Thermal
This section describes the thermal specifications of the MPC8572E.
Table 84 shows the thermal characteristics for the package, 1023 33
× 33 FC-PBGA.
The package uses a 29.6
× 29.6 mm lid that attaches to the substrate. Recommended maximum heat sink
force is 10 pounds force (45 Newton).
Table 84. Package Thermal Characteristics
Rating
Board
Symbol
Value
Unit
Notes
Junction to ambient, natural convection
Single-layer (1s)
RΘJA
15
°C/W
1, 2
Junction to ambient, natural convection
Four-layer (2s2p)
RΘJA
11
°C/W
1, 3
Junction to ambient (at 200 ft./min.)
Single-layer (1s)
RΘJMA
11
°C/W
1, 3
Junction to ambient (ar 200 ft./min.)
Four-layer (2s2p)
RΘJMA
8
°C/W
1, 3
Junction to board
—
RΘJB
4
°C/W
4
527 MHz
PCI Express link width
()
×
8
----------------------------------------------------------------------------------------------
20.80
()
serial RapidIO interface frequency
()
×
serial RapidIO link width
()
×
64
-----------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------
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MPC8572ECVTARLE 功能描述:微處理器 - MPU R211 Enc NoPb 1067LP Ext RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8572ECVTAULB 功能描述:微處理器 - MPU RV1.1.1 1333 EXT T RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8572ECVTAULD 功能描述:微處理器 - MPU 1333 EXT TEMP RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8572ECVTAULE 功能描述:微處理器 - MPU R211 Enc NoPb 1333 Ext RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8572ECVTAVND 功能描述:微處理器 - MPU 1500 ExtTmp RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
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